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STV3208CV

STMicroelectronics

STV3208CV by STMicroelectronics

STV3208CV by STMicroelectronics is a DSP Peripheral with 12-bit output data bus width, 27 MHz max clock frequency, and 9-bit external data bus width. It is used in Fast Cosine Transform Processor applications due to its CMOS technology, operating temperature range of 0-70 °C, and quad terminal position.

Median Price

$33.590

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 42 parts In-Stock

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$33.590

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42

$33.590

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Vyrian

USA . 4,635 parts In-Stock

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4,635

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Anansix

USA . 1,864 parts In-Stock

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1,864

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Digiode

USA . 1,732 parts In-Stock

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1,732

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DF Sales Co.

USA . 30 parts In-Stock

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30

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DF Sales Co.

USA . 30 parts In-Stock

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30

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Resion

USA . 19 parts In-Stock

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19

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Q Components

USA . 16 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 24 parts In-Stock

1+ parts

$19.618

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24

$19.618

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$40.300

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$36.270

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188

$40.300

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$36.270

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MKK Technologies

India . 1,321 parts In-Stock

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$75.781

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1,321

$75.781

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DigiPath Technology Company

USA . 1,321 parts In-Stock

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$75.781

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1,321

$75.781

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Assy Fe

Spain . 5,434 parts In-Stock

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Corphita

USA . 4,445 parts In-Stock

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4,445

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Parana Technologies

USA . 1,196 parts In-Stock

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$48.184

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1,196

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$48.184

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Perfect Parts

USA . 1 parts In-Stock

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Overview

Get ready to experience top-of-the-line performance with the STV3208CV from STMicroelectronics. This DSP Peripherals powerhouse offers unparalleled quality and reliability, making it the go-to choice for a wide range of applications. With a maximum supply voltage of 5.25V and a maximum clock frequency of 27MHz, this product delivers outstanding results every time. Trust in STMicroelectronics to provide you with cutting-edge technology that will take your projects to the next level. Unlock the full potential of your designs with the STV3208CV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Surface Mount: YES

The surface mount feature makes it easier to integrate the product into electronic devices, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for a wider range of input power options, increasing flexibility in application.

Package Shape: SQUARE

The square package shape allows for easy mounting and alignment within a circuit board layout.

Output Data Bus Width: 12

With a wider output data bus width of 12, the product can process and transmit data more efficiently.

No. of Terminals: 44

The high number of terminals allows for versatile connectivity options and functionality.

Package Style (Meter): FLATPACK

The flatpack package style offers a low-profile design, ideal for space-constrained applications.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature makes the product suitable for use in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity for efficient connections.

Terminal Position: QUAD

The quad terminal position allows for secure mounting and stable connections.

Maximum Seated Height: 3.4 mm

The low maximum seated height enables the product to be used in slim and compact devices.

Width: 14 mm

The compact width of 14mm makes the product suitable for applications with limited space.

External Data Bus Width: 9

The external data bus width of 9 enhances data processing capabilities and overall performance.

Maximum Clock Frequency: 27 MHz

The high maximum clock frequency of 27 MHz allows for fast data processing and operation speed.

Length: 14 mm

The compact length of 14mm complements the width, making the product suitable for compact designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product meets industry standards for performance and reliability.

Peripheral IC Type: DSP PERIPHERAL, FAST COSINE TRANSFRM PROCESSOR

The incorporation of a fast cosine transform processor enhances the product's signal processing capabilities for advanced applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and fast.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering for reliable connections.

Maximum Supply Current: 150 mA

The maximum supply current of 150 mA ensures efficient power consumption, ideal for battery-operated devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures stable and reliable operation within the specified voltage range.

Terminal Pitch: 1 mm

The 1mm terminal pitch offers easy placement and soldering on standard PCB layouts for convenient assembly.

Technical Specifications

DSP Peripherals STV3208CV attributes and parameters. Explore more DSP Peripherals devices from STMicroelectronics

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

9

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e0

Length:

14 mm

Low Power Mode:

NO

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

12

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3.4 mm

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV3208CV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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