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ADSP-1012ASE

Analog Devices

ADSP-1012ASE by Analog Devices

ADSP-1012ASE by Analog Devices is a CMOS DSP Peripheral IC with 68 terminals in a square chip carrier package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications. It features a 5V supply voltage and is surface-mountable, making it ideal for various signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,001 parts In-Stock

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Digiode

USA . 947 parts In-Stock

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947

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Native Components

USA . 998 parts In-Stock

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$0.074

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$0.071

998

$0.074

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$0.071

Northwest PG Solutions

USA . 301 parts In-Stock

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$0.081

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$0.072

301

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AZTECH Wire

Italy . 656 parts In-Stock

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$12.654

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656

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Semicontronic

India . 1,627 parts In-Stock

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$20.000

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$19.500

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$19.400

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One Stop Electronics

USA . 155 parts In-Stock

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$31.000

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Parana Technologies

USA . 4,335 parts In-Stock

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$46.173

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$42.941

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$46.173

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$42.941

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IDEA Electronic Components Group

UK . 1,261 parts In-Stock

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$49.648

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$47.166

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Corohmni

South Africa . 2,527 parts In-Stock

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$59.861

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DigiPath Technology Company

USA . 4,335 parts In-Stock

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$77.451

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$74.353

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$74.353

4,335

$77.451

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Corphita

USA . 991 parts In-Stock

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Overview

Enhance your digital signal processing capabilities with the ADSP-1012ASE by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality DSP peripherals that excel in a variety of applications. With its advanced technology and military-grade temperature grade, this chip carrier package offers unmatched performance and reliability. Trust Analog Devices to provide you with the cutting-edge solutions you need to take your projects to the next level. Unlock the full potential of your designs with the ADSP-1012ASE today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent durability and thermal conductivity, ensuring that the product can withstand high temperatures and harsh conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Power Supplies (V): 5

Operating at a standard 5V power supply makes this product compatible with a wide range of electronic systems and components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and lightweight, making it ideal for applications that require high-density integration.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can handle high levels of heat without compromising its performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in data processing applications.

Technical Specifications

DSP Peripherals ADSP-1012ASE attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e0

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC68,.95SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

ADSP-1012ASE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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