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SN74S274JP4

Texas Instruments

SN74S274JP4 by Texas Instruments

SN74S274JP4 by Texas Instruments is a DSP peripheral IC with TTL technology. It features 20 terminals in an in-line rectangular ceramic package, operating b/w 0°C to 70°C. Ideal for applications requiring a commercial-grade dual terminal multiplier for digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,340 parts In-Stock

1+ parts

-

100+ parts

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3,340

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Digiode

USA . 1,395 parts In-Stock

1+ parts

-

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1,395

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,155 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

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10k+ parts

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1,155

$5.000

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AZTECH Wire

Italy . 285 parts In-Stock

1+ parts

$5.221

100+ parts

-

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285

$5.221

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Parana Technologies

USA . 1,232 parts In-Stock

1+ parts

$18.226

100+ parts

-

1k+ parts

$18.362

10k+ parts

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1,232

$18.226

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$18.362

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DigiPath Technology Company

USA . 2,214 parts In-Stock

1+ parts

$20.069

100+ parts

-

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2,214

$20.069

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ChromeModa Solutions

Germany . 2,618 parts In-Stock

1+ parts

$20.479

100+ parts

$16.793

1k+ parts

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10k+ parts

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2,618

$20.479

$16.793

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IDEA Electronic Components Group

UK . 1,113 parts In-Stock

1+ parts

$20.479

100+ parts

$19.455

1k+ parts

$18.431

10k+ parts

-

1,113

$20.479

$19.455

$18.431

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Corohmni

South Africa . 1,059 parts In-Stock

1+ parts

$63.424

100+ parts

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1,059

$63.424

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Corphita

USA . 1,850 parts In-Stock

1+ parts

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1,850

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Overview

Enhance your digital signal processing projects with the high-quality SN74S274JP4 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch performance and reliability. This DSP Peripheral is versatile and ideal for a variety of applications. With its advanced technology and innovative design, this product offers unmatched value and benefits to customers. Upgrade your projects today with the SN74S274JP4 and experience superior results.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and electrical insulation, making the product durable and reliable.

No. of Terminals: 20

Sufficient number of terminals allows for versatile connectivity options and integration with other devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in demanding environments.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Designed specifically for digital signal processing applications with dedicated multiplier functionality, enhancing the processing capability of the system.

Technology: TTL

TTL technology offers good noise immunity and compatibility with a wide range of digital systems, ensuring seamless integration with existing setups.

Technical Specifications

DSP Peripherals SN74S274JP4 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74S274JP4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-104-4770, 5962011044770

NIIN

011044770

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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