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THCT1010-100N

Texas Instruments

THCT1010-100N by Texas Instruments

THCT1010-100N by Texas Instruments is a DSP Peripheral with 35-bit output data bus width, 16-bit external data bus width, and operates at 5V. It is used in applications requiring a Multiplier Accumulator/Summer peripheral IC type, such as signal processing systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,308 parts In-Stock

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4,308

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Digiode

USA . 2,955 parts In-Stock

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2,955

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,369 parts In-Stock

1+ parts

$12.000

100+ parts

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1,369

$12.000

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AZTECH Wire

Italy . 411 parts In-Stock

1+ parts

$18.383

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411

$18.383

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Parana Technologies

USA . 2,371 parts In-Stock

1+ parts

$40.556

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2,371

$40.556

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DigiPath Technology Company

USA . 356 parts In-Stock

1+ parts

$44.657

100+ parts

$41.084

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356

$44.657

$41.084

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ChromeModa Solutions

Germany . 719 parts In-Stock

1+ parts

$45.568

100+ parts

$37.366

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719

$45.568

$37.366

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IDEA Electronic Components Group

UK . 415 parts In-Stock

1+ parts

$45.568

100+ parts

$43.290

1k+ parts

$41.011

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415

$45.568

$43.290

$41.011

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Corohmni

South Africa . 3,053 parts In-Stock

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$46.331

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3,053

$46.331

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Corphita

USA . 968 parts In-Stock

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968

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Overview

Experience the power of cutting-edge technology with the THCT1010-100N by Texas Instruments. This DSP peripheral offers unparalleled performance and reliability, thanks to its top-notch manufacturer. Ideal for a wide range of applications, this product boasts a sleek design and efficient operation. Unlock endless possibilities with this innovative solution that delivers exceptional value, benefits, and advantages to customers looking for superior quality and performance in their projects. Elevate your work with the THCT1010-100N today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power requirements.

Package Shape: RECTANGULAR

The rectangular shape is easy to handle and fits well in most circuit designs.

Output Data Bus Width: 35

The wide output data bus allows for faster data transfer and processing capabilities.

Power Supplies (V): 5

The standard power supply of 5V makes it compatible with most systems and easy to integrate.

No. of Terminals: 64

Having a higher number of terminals provides more connectivity options and flexibility in circuit design.

Package Style (Meter): IN-LINE

The in-line package style saves space and provides a neat and organized layout in the circuit.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power usage and protection against voltage fluctuations.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand varying environmental conditions without performance issues.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in colder environments without any issues.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connection options for enhanced reliability.

Width: 22.86 mm

The compact width makes it suitable for applications where space is limited without compromising on performance.

External Data Bus Width: 16

Having a wide external data bus width allows for efficient data transfer and processing capabilities in the system.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

The DSP peripheral with multiplier accumulator/summer functionality offers advanced signal processing capabilities for various applications.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity for reliable operation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure connections and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources and ease of integration.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy connections and compatibility with standard connectors.

Technical Specifications

DSP Peripherals THCT1010-100N attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T64

Low Power Mode:

NO

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

35

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP64,.9

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

22.86 mm

Trade Compliance

THCT1010-100N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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