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THCT1010-100NE

Texas Instruments

THCT1010-100NE by Texas Instruments

THCT1010-100NE by Texas Instruments is a DSP Peripheral with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and CMOS technology. Ideal for industrial applications requiring a multiplier accumulator/summer IC in an in-line package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,271 parts In-Stock

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Digiode

USA . 2,352 parts In-Stock

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One Stop Electronics

USA . 255 parts In-Stock

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$3.000

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255

$3.000

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AZTECH Wire

Italy . 234 parts In-Stock

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$9.308

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234

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Parana Technologies

USA . 1,087 parts In-Stock

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$45.150

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$45.150

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DigiPath Technology Company

USA . 301 parts In-Stock

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$49.715

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$45.738

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301

$49.715

$45.738

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ChromeModa Solutions

Germany . 5,670 parts In-Stock

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$50.730

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$41.599

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5,670

$50.730

$41.599

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IDEA Electronic Components Group

UK . 311 parts In-Stock

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$50.730

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$48.194

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$45.657

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311

$50.730

$48.194

$45.657

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Corohmni

South Africa . 577 parts In-Stock

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$66.890

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Corphita

USA . 1,866 parts In-Stock

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Overview

Upgrade your DSP system with the THCT1010-100NE by Texas Instruments, a reliable and high-quality DSP peripheral designed to enhance performance and efficiency. Manufactured by a trusted industry leader, this product offers exceptional value and benefits for a wide range of applications. With its durable construction and industrial-grade temperature rating, the THCT1010-100NE ensures reliability in even the most demanding environments. Experience the advantages of this versatile DSP peripheral and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protection, making the product reliable and long-lasting.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into various electronic systems.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with standard power sources and reduces the need for additional power conversion.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options and integration with various devices and systems.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance processes, enhancing overall usability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, increasing its versatility.

Minimum Operating Temperature: -40 °C

The ability to operate at -40°C ensures reliable performance even in extreme cold conditions.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

The DSP peripheral with multiplier accumulator/summer functionality offers advanced processing capabilities, making the product suitable for complex signal processing tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, improving overall performance efficiency.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts ensures compatibility and stability in various electronic systems.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connectivity and integration into standard electronic setups.

Technical Specifications

DSP Peripherals THCT1010-100NE attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP64,.9

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

THCT1010-100NE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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