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SNJ54AS8838GB

Texas Instruments

SNJ54AS8838GB by Texas Instruments

SNJ54AS8838GB by Texas Instruments is a DSP peripheral with 32-bit output data bus width and CMOS technology. It operates in military-grade temperatures from -55°C to 125°C, making it suitable for rugged applications. The package style is grid array with 84 terminals in a square shape, ideal for high-performance signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,972 parts In-Stock

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3,972

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Vyrian

USA . 2,581 parts In-Stock

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2,581

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Distributors (Availability)

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AZTECH Wire

Italy . 476 parts In-Stock

1+ parts

$9.723

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476

$9.723

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One Stop Electronics

USA . 1,375 parts In-Stock

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$29.000

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1,375

$29.000

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Parana Technologies

USA . 721 parts In-Stock

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$37.350

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721

$37.350

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DigiPath Technology Company

USA . 1,932 parts In-Stock

1+ parts

$41.127

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$37.837

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1,932

$41.127

$37.837

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ChromeModa Solutions

Germany . 3,569 parts In-Stock

1+ parts

$41.966

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$34.412

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3,569

$41.966

$34.412

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IDEA Electronic Components Group

UK . 1,945 parts In-Stock

1+ parts

$41.966

100+ parts

$39.868

1k+ parts

$37.769

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1,945

$41.966

$39.868

$37.769

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Corohmni

South Africa . 972 parts In-Stock

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$63.434

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972

$63.434

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Corphita

USA . 2,042 parts In-Stock

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Overview

Discover the exceptional quality and reliability of the SNJ54AS8838GB by Texas Instruments, a leading manufacturer in the industry. This DSP Peripheral offers unparalleled performance and versatility in a wide range of applications. With its cutting-edge technology and military-grade temperature grade, this product ensures optimal functionality even in the harshest conditions. Experience the value and benefits that Texas Instruments brings to customers with the SNJ54AS8838GB, providing superior output data bus width and terminal position for seamless integration. Elevate your projects with this top-of-the-line solution from a trusted brand.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high durability and reliability, making this product suitable for harsh operating environments.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product can handle higher voltage levels without risk of damage, providing flexibility in power supply options.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into various electronic systems.

Output Data Bus Width: 32

The 32-bit output data bus width enables high-speed data processing and communication, making this product ideal for applications requiring fast data transfer.

No. of Terminals: 84

The 84 terminals provide ample connectivity options, allowing for versatile integration into complex electronic systems.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, this product can operate even in lower power scenarios without compromising its performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows this product to function effectively in extreme cold conditions.

Terminal Position: PERPENDICULAR

The perpendicular terminal position simplifies the installation and connection process, enhancing usability and convenience.

External Data Bus Width: 32

The 32-bit external data bus width supports high-speed data transfer between the product and external components, facilitating efficient communication.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that this product can withstand rigorous environmental conditions and operate reliably in demanding military applications.

Peripheral IC Type: DSP PERIPHERAL, BARREL SHIFTER

The inclusion of a barrel shifter in the DSP peripheral IC type enhances the product's data manipulation capabilities, making it suitable for signal processing applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise tolerance, and compatibility with a wide range of electronic systems.

Terminal Form: PIN/PEG

The pin/peg terminal form provides secure and reliable connections, ensuring stable operation and easy maintenance of the product.

Nominal Supply Voltage: 5 V

The 5 V nominal supply voltage is a common standard in many electronic systems, ensuring seamless integration and compatibility with various applications.

Technical Specifications

DSP Peripherals SNJ54AS8838GB attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P84

Low Power Mode:

NO

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

32

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SNJ54AS8838GB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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