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AD9859YSV

Analog Devices

AD9859YSV by Analog Devices

AD9859YSV by Analog Devices is a DSP peripheral with 48 terminals, operating at max clock frequency of 400 MHz. It features low power mode and CMOS technology, suitable for industrial applications requiring precise numeric controlled oscillation. The package style is flatpack with thin profile and fine pitch, making it ideal for compact designs in temperature-sensitive environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,579 parts In-Stock

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6,579

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LIBRA Elektronik GmbH

Germany . 500 parts In-Stock

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500

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Digiode

USA . 330 parts In-Stock

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330

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 404 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

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404

$3.000

$2.925

$2.910

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Vigor

Singapore . 1,799 parts In-Stock

1+ parts

$17.880

100+ parts

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1,799

$17.880

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AZTECH Wire

Italy . 801 parts In-Stock

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$19.578

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801

$19.578

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Corohmni

South Africa . 2,963 parts In-Stock

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$24.591

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2,963

$24.591

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One Stop Electronics

USA . 835 parts In-Stock

1+ parts

$28.000

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835

$28.000

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Parana Technologies

USA . 381 parts In-Stock

1+ parts

$50.812

100+ parts

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$47.256

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381

$50.812

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$47.256

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IDEA Electronic Components Group

UK . 2,287 parts In-Stock

1+ parts

$54.637

100+ parts

$51.905

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2,287

$54.637

$51.905

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DigiPath Technology Company

USA . 2,254 parts In-Stock

1+ parts

$85.234

100+ parts

$81.824

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$81.824

2,254

$85.234

$81.824

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$81.824

Northwest PG Solutions

USA . 643 parts In-Stock

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643

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Corphita

USA . 639 parts In-Stock

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639

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Native Components

USA . 338 parts In-Stock

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338

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Overview

Unlock endless possibilities with the AD9859YSV by Analog Devices. Manufactured by a trusted industry leader, this DSP Peripheral offers unparalleled quality and reliability. Ideal for applications requiring precise numeric controlled oscillation, this innovative product delivers exceptional value and performance. Seamlessly integrating cutting-edge technology with a user-friendly design, the AD9859YSV ensures maximum efficiency and accuracy in every operation. Upgrade your systems and elevate your projects with the unmatched benefits and advantages of the AD9859YSV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving manufacturing time and cost.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in design.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 48

With a high number of terminals, this product offers a wide range of connectivity options for various applications.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

The flatpack design with a thin profile and fine pitch offers high component density and improved signal integrity, enhancing overall performance.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption, making the product suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance in harsh environments or under heavy load conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can operate in a wide range of temperature conditions, providing versatility.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures good solderability and conductivity, making the product easy to assemble and reliable in operation.

Terminal Position: QUAD

The quad terminal position provides multiple connection points for improved signal routing and robustness.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for a slim profile, making the product suitable for applications where space is limited.

Width: 7 mm

The compact width dimension allows for efficient use of board space, facilitating compact and space-saving designs.

Maximum Clock Frequency: 400 MHz

The high maximum clock frequency enables fast processing speeds, making the product ideal for demanding computational tasks.

Peak Reflow Temperature °C: 240

The high peak reflow temperature ensures reliable solder joints during the manufacturing process, leading to a durable end product.

Length: 7 mm

The compact length dimension complements the width dimension, allowing for a square package shape that optimizes board space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: DSP PERIPHERAL, NUMERIC CONTROLLED OSCILLATOR

The inclusion of a DSP peripheral and numeric controlled oscillator enhances the product's processing capabilities and performance in signal processing applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a stable operating voltage for the product, ensuring consistent performance over a wide range of conditions.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and efficient use of board space, making the product suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product is moderately sensitive to moisture, requiring proper handling during storage and assembly.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation, extending battery life in portable devices and reducing overall power consumption.

Technical Specifications

DSP Peripherals AD9859YSV attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

400 MHz

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e0

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

AD9859YSV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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