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ADSP-3222SG/+

Analog Devices

ADSP-3222SG/+ by Analog Devices

Analog Devices' ADSP-3222SG/+ is a MILITARY-grade DSP Peripheral with 144 PIN/PEG terminals in a CERAMIC GRID ARRAY package. It operates b/w -55 to 125 °C, featuring CMOS technology and FLOATING POINT PROCESSOR for signal processing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 11,384 parts In-Stock

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Digiode

USA . 794 parts In-Stock

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One Stop Electronics

USA . 559 parts In-Stock

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$1.000

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559

$1.000

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Native Components

USA . 809 parts In-Stock

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$2.130

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809

$2.130

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Northwest PG Solutions

USA . 2,214 parts In-Stock

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$2.343

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$2.343

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Semicontronic

India . 877 parts In-Stock

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$4.000

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$3.900

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$3.880

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877

$4.000

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$3.880

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AZTECH Wire

Italy . 419 parts In-Stock

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$16.552

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419

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Parana Technologies

USA . 1,652 parts In-Stock

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$41.817

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$38.890

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IDEA Electronic Components Group

UK . 261 parts In-Stock

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$44.965

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$42.717

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Corohmni

South Africa . 5,151 parts In-Stock

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$49.980

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DigiPath Technology Company

USA . 554 parts In-Stock

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$70.145

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$67.340

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554

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Corphita

USA . 375 parts In-Stock

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Overview

Elevate your DSP game with the ADSP-3222SG/+ by Analog Devices. This high-quality DSP peripheral offers unparalleled performance and reliability, thanks to its military-grade technology and ceramic package body material. From floating point processing to advanced signal processing applications, this product is designed to deliver exceptional value and benefits to customers seeking top-notch performance in their projects. Trust Analog Devices for cutting-edge solutions that elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high temperature resistance, making it ideal for military-grade applications where reliability and durability are key.

No. of Terminals: 144

Having a high number of terminals allows for more connectivity options and functionality in a single package, making the product versatile and efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extreme conditions without sacrificing performance, ensuring reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Technical Specifications

DSP Peripherals ADSP-3222SG/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P144

JESD-609 Code:

e0

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

ADSP-3222SG/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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