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GC2011A-CQ

Texas Instruments

GC2011A-CQ by Texas Instruments

GC2011A-CQ by Texas Instruments is a DSP peripheral with 16-bit output data bus, 106 MHz clock frequency, and 3.3V nominal voltage. Ideal for digital filtering applications in industrial settings due to its low power mode, -40 to 85°C operating temperature range, and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,769 parts In-Stock

1+ parts

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5,769

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Digiode

USA . 3,102 parts In-Stock

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3,102

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Distributors (Availability)

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Native Components

USA . 700 parts In-Stock

1+ parts

$0.500

100+ parts

-

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700

$0.500

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Northwest PG Solutions

USA . 1,823 parts In-Stock

1+ parts

$0.550

100+ parts

-

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$0.485

1,823

$0.550

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$0.485

One Stop Electronics

USA . 941 parts In-Stock

1+ parts

$12.000

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941

$12.000

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AZTECH Wire

Italy . 293 parts In-Stock

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$17.109

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293

$17.109

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Parana Technologies

USA . 965 parts In-Stock

1+ parts

$21.611

100+ parts

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$22.012

10k+ parts

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965

$21.611

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$22.012

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DigiPath Technology Company

USA . 1,032 parts In-Stock

1+ parts

$23.796

100+ parts

$21.893

1k+ parts

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1,032

$23.796

$21.893

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ChromeModa Solutions

Germany . 3,834 parts In-Stock

1+ parts

$24.282

100+ parts

$19.911

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3,834

$24.282

$19.911

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IDEA Electronic Components Group

UK . 726 parts In-Stock

1+ parts

$24.282

100+ parts

$23.068

1k+ parts

$21.854

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726

$24.282

$23.068

$21.854

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Corohmni

South Africa . 322 parts In-Stock

1+ parts

$66.712

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322

$66.712

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Corphita

USA . 387 parts In-Stock

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387

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Overview

Elevate your digital signal processing capabilities with the GC2011A-CQ by Texas Instruments. Crafted with precision and expertise, this DSP Peripheral offers unparalleled performance and reliability. Perfect for a wide range of applications, from digital filters to signal processing tasks, this product delivers exceptional value and benefits to customers. With its advanced technology and innovative design, the GC2011A-CQ is the ideal choice for those looking to elevate their projects to new heights. Trust in Texas Instruments to provide you with the quality and advantages you need to succeed.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability for the product.

Surface Mount: YES

Allows for easy assembly and integration into various electronic devices.

Maximum Supply Voltage: 3.5 V

Provides flexibility in power supply options.

Package Shape: SQUARE

Helps in efficient placement and organization of components on a circuit board.

Output Data Bus Width: 16

Allows for fast and efficient data processing.

No. of Terminals: 160

Provides versatility and connectivity options for various interfaces.

Package Style (Meter): FLATPACK

Helps in compact design and space-saving on the circuit board.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ensures operational functionality in extreme temperature conditions.

Peripheral IC Type: DSP PERIPHERAL, DIGITAL FILTER

Indicates a specialized functionality for digital signal processing and filtering tasks.

Technical Specifications

DSP Peripherals GC2011A-CQ attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

106 MHz

External Data Bus Width:

12

JESD-30 Code:

S-CQFP-G160

Length:

28 mm

Low Power Mode:

YES

No. of Terminals:

160

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Data Bus Width:

16

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFP

Package Equivalence Code:

QFP160,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

3.5 V

Minimum Supply Voltage:

3.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

GC2011A-CQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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