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ADSP1010SF

Analog Devices

ADSP1010SF by Analog Devices

Analog Devices' ADSP1010SF is a DSP Peripheral with 64 terminals, operating b/w -55°C to 125°C. It features a CMOS technology, 5V supply voltage, and MILITARY temperature grade. Ideal for applications requiring a Multiplier Accumulator/Summer in a SQUARE ceramic package with Tin/Lead finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,669 parts In-Stock

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Digiode

USA . 439 parts In-Stock

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439

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Native Components

USA . 564 parts In-Stock

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$5.159

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564

$5.159

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Semicontronic

India . 1,379 parts In-Stock

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$9.000

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$8.775

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$8.730

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$9.000

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AZTECH Wire

Italy . 551 parts In-Stock

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$13.416

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Parana Technologies

USA . 1,902 parts In-Stock

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$26.370

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$24.524

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1,902

$26.370

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

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$28.355

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$26.937

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One Stop Electronics

USA . 1,539 parts In-Stock

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$34.000

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DigiPath Technology Company

USA . 980 parts In-Stock

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$44.234

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$42.464

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$42.464

980

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$42.464

Corohmni

South Africa . 1,138 parts In-Stock

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$69.889

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Northwest PG Solutions

USA . 1,342 parts In-Stock

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$5.056

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Corphita

USA . 581 parts In-Stock

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Overview

Enhance your digital signal processing capabilities with the Analog Devices ADSP1010SF. Crafted with precision and expertise by a trusted manufacturer, this DSP peripheral offers unparalleled performance and reliability. Whether you're working on audio processing, communications, or control systems, this product provides the cutting-edge technology you need to stay ahead. With its military-grade temperature grade and advanced features like multiplier accumulator/summer, the ADSP1010SF delivers superior value and benefits to customers seeking top-tier solutions. Elevate your projects with the quality and innovation of Analog Devices.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal conductivity and heat dissipation, making it ideal for high-performance applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape allows for easier PCB layout and maximizes space efficiency.

Power Supplies (V): 5

Operating at a standard 5V power supply makes this product compatible with a wide range of systems and applications.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for various inputs and outputs, increasing the versatility of the product.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor while still providing sufficient space for components, enabling a more streamlined design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand intense usage and environmental conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and conductivity, enhancing the overall reliability of the connections.

Terminal Position: QUAD

Quad terminal position allows for easy alignment and soldering on the PCB, reducing assembly time and effort.

Temperature Grade: MILITARY

Military-grade temperature rating ensures durability and reliability under harsh conditions, making this product suitable for demanding applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

Being a DSP peripheral with multiplier accumulator/summer functionality, this product is designed for high-speed data processing and signal manipulation tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and high-performing.

Terminal Form: FLAT

Flat terminal form factor simplifies PCB layout and soldering process, ensuring a reliable connection and efficient assembly.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems easier.

Terminal Pitch: 1.27 mm

With a pitch of 1.27mm, terminals are optimally spaced for efficient interconnection and soldering, enhancing the overall performance and reliability of the product.

Technical Specifications

DSP Peripherals ADSP1010SF attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XQFP-F64

JESD-609 Code:

e0

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

QFF

Package Equivalence Code:

QFL64,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

ADSP1010SF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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