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TACT1010-65JDE

Texas Instruments

TACT1010-65JDE by Texas Instruments

TACT1010-65JDE by Texas Instruments is a DSP Peripheral IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and CMOS technology, suitable for industrial applications requiring multiplier accumulator/summer functionality in an inline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,897 parts In-Stock

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Digiode

USA . 3,601 parts In-Stock

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3,601

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AZTECH Wire

Italy . 417 parts In-Stock

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$11.556

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$11.556

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One Stop Electronics

USA . 859 parts In-Stock

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$28.000

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$28.000

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Corohmni

South Africa . 2,144 parts In-Stock

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$29.824

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Parana Technologies

USA . 717 parts In-Stock

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$35.127

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717

$35.127

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DigiPath Technology Company

USA . 886 parts In-Stock

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$38.680

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$35.585

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886

$38.680

$35.585

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ChromeModa Solutions

Germany . 4,559 parts In-Stock

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$39.469

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$32.365

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$39.469

$32.365

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IDEA Electronic Components Group

UK . 99 parts In-Stock

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$39.469

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$37.496

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$35.522

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99

$39.469

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Corphita

USA . 4,429 parts In-Stock

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Overview

Elevate your DSP peripherals with the TACT1010-65JDE by Texas Instruments. Crafted with precision and expertise, this product is designed to deliver exceptional performance in a wide range of industrial applications. With a package body material of ceramic and a package shape that is rectangular, this DSP peripheral is built to withstand even the toughest environments. Unlock the power of innovation and reliability with Texas Instruments' TACT1010-65JDE, offering customers unparalleled value and benefits that exceed expectations. Experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent resistance to high temperatures and helps to dissipate heat efficiently, making this product suitable for industrial applications.

Power Supplies (V): 5

Operating at a supply voltage of 5V makes this product compatible with a wide range of power sources and ensures reliable performance.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options and the ability to interface with multiple devices or components.

Package Style (Meter): IN-LINE

The in-line package style makes this product easy to integrate into existing systems or circuit designs without taking up excessive space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that this product can withstand harsh environmental conditions and maintain optimal performance.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can operate reliably in cold environments without risk of malfunction.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand demanding operating conditions and provide consistent performance under varying temperatures.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

The DSP peripheral functionality, along with multiplier accumulator/summer capabilities, enables this product to perform complex mathematical operations efficiently and accurately.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance, making this product energy-efficient and suitable for demanding computational tasks.

Terminal Form: THROUGH-HOLE

The through-hole terminal form factor provides secure and reliable connections, enhancing the durability and longevity of this product in rugged environments.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and helps to maintain stable performance across different applications.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, this product offers easy integration and soldering onto circuit boards, simplifying the assembly process and reducing potential errors.

Technical Specifications

DSP Peripherals TACT1010-65JDE attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP64,.9

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TACT1010-65JDE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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