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TMS34082B-32GC

Texas Instruments

TMS34082B-32GC by Texas Instruments

TMS34082B-32GC by Texas Instruments is a DSP Peripheral with 32-bit output data bus width, operating at max 16.7 MHz clock frequency. Ideal for commercial applications requiring high-speed processing and floating-point calculations in a compact square package with 145 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,152 parts In-Stock

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Digiode

USA . 538 parts In-Stock

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538

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Distributors (Availability)

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$5.151

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216

$5.151

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One Stop Electronics

USA . 605 parts In-Stock

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$32.000

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605

$32.000

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Parana Technologies

USA . 1,170 parts In-Stock

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$35.879

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1,170

$35.879

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DigiPath Technology Company

USA . 286 parts In-Stock

1+ parts

$39.508

100+ parts

$36.347

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286

$39.508

$36.347

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ChromeModa Solutions

Germany . 6,460 parts In-Stock

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$40.314

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$33.057

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6,460

$40.314

$33.057

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IDEA Electronic Components Group

UK . 173 parts In-Stock

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$40.314

100+ parts

$38.298

1k+ parts

$36.283

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173

$40.314

$38.298

$36.283

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Corohmni

South Africa . 899 parts In-Stock

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$41.176

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$41.176

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Corphita

USA . 913 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS34082B-32GC by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality DSP peripherals that redefine possibilities. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers. Experience seamless performance and reliability like never before with the TMS34082B-32GC, setting new standards in innovation and efficiency. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures durability and reliability for the product, making it suitable for harsh operating conditions.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle varying power inputs effectively, providing flexibility in different system configurations.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy integration into various device designs.

Output Data Bus Width: 32

A wide output data bus width of 32 bits enables fast data processing and efficient communication between components in the system.

No. of Terminals: 145

The high number of terminals provides a wide range of connectivity options, allowing for versatile integration into different systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in high-temperature environments, enhancing the product's longevity and stability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in cold environments, making it suitable for a wide range of applications.

Maximum Seated Height: 5.72 mm

The compact maximum seated height of 5.72 mm saves space and facilitates easier integration into compact electronic devices.

Maximum Clock Frequency: 16.7 MHz

With a high maximum clock frequency, this product can handle rapid data processing tasks efficiently, resulting in improved system performance.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets the necessary temperature requirements for standard operating environments, ensuring compatibility with a wide range of applications.

Technical Specifications

DSP Peripherals TMS34082B-32GC attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Additional Features:

64 BIT DOUBLE PRECISION FPU; COPROCESSOR AND HOST INDEPENDENT MODES OF OPERATION

Boundary Scan:

YES

Maximum Clock Frequency:

16.7 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P145

Length:

38.85 mm

Low Power Mode:

NO

No. of Terminals:

145

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

32

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

38.85 mm

Trade Compliance

TMS34082B-32GC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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