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TMS34082A-32GC

Texas Instruments

TMS34082A-32GC by Texas Instruments

TMS34082A-32GC by Texas Instruments is a DSP Peripheral with 32-bit output data bus width, operating at 16.7 MHz clock frequency. Ideal for commercial applications requiring a floating-point processor, it features a max supply voltage of 5.25 V and operates in temperatures ranging from 0 to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,059 parts In-Stock

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3,059

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Digiode

USA . 1,240 parts In-Stock

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1,240

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Distributors (Availability)

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$14.553

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755

$14.553

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One Stop Electronics

USA . 1,642 parts In-Stock

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$15.000

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$15.000

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Corohmni

South Africa . 981 parts In-Stock

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$35.954

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981

$35.954

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Parana Technologies

USA . 2,220 parts In-Stock

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$51.762

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2,220

$51.762

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DigiPath Technology Company

USA . 495 parts In-Stock

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$56.997

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$52.437

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495

$56.997

$52.437

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IDEA Electronic Components Group

UK . 1,567 parts In-Stock

1+ parts

$58.160

100+ parts

$55.252

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$52.344

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1,567

$58.160

$55.252

$52.344

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ChromeModa Solutions

Germany . 186 parts In-Stock

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$58.160

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$47.691

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Corphita

USA . 4,273 parts In-Stock

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Overview

Discover the powerful performance and reliability of the TMS34082A-32GC by Texas Instruments, a top-of-the-line DSP Peripheral that delivers unparalleled value to customers. With Texas Instruments' reputation for excellence in manufacturing, this product is designed to exceed expectations in a wide range of applications. Whether you're looking to enhance your audio processing capabilities or optimize your digital signal processing tasks, this product offers cutting-edge technology and seamless integration. Upgrade your projects with the TMS34082A-32GC and experience superior quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.25 V

Ability to operate at high supply voltage allows for flexibility in power supply options.

Output Data Bus Width: 32

Wide data bus width allows for faster data processing and handling of large amounts of data simultaneously.

Maximum Clock Frequency: 16.7 MHz

High clock frequency enables fast processing speed and efficient performance.

Temperature Grade: COMMERCIAL

Commercial grade temperature range makes the product suitable for typical operating conditions in various industries.

Technical Specifications

DSP Peripherals TMS34082A-32GC attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Additional Features:

64 BIT DOUBLE PRECISION FPU; COPROCESSOR AND HOST INDEPENDENT MODES OF OPERATION

Boundary Scan:

YES

Maximum Clock Frequency:

16.7 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P145

Length:

38.85 mm

Low Power Mode:

NO

No. of Terminals:

145

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

32

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

38.85 mm

Trade Compliance

TMS34082A-32GC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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