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GC2011A-PB

Texas Instruments

GC2011A-PB by Texas Instruments

GC2011A-PB by Texas Instruments is a DSP peripheral with 16-bit output data bus width and 106 MHz max clock frequency. It is ideal for digital filtering applications, featuring low power mode, 3.3V nominal voltage, and industrial temperature grade suitability.

Median Price

$148.735

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,779 parts In-Stock

1+ parts

$136.770

100+ parts

$128.560

1k+ parts

$120.360

10k+ parts

-

6,779

$136.770

$128.560

$120.360

-

DigiKey

USA . 6,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,673

-

-

-

-

Verical

USA . 3,471 parts In-Stock

1+ parts

-

100+ parts

$160.700

1k+ parts

$150.450

10k+ parts

-

3,471

-

$160.700

$150.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 30 parts In-Stock

1+ parts

$15.710

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$15.710

-

-

-

TEDSS.com

USA . 1 parts In-Stock

1+ parts

$124.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$124.990

-

-

-

Digiode

USA . 1,123 parts In-Stock

1+ parts

$150.870

100+ parts

-

1k+ parts

-

10k+ parts

-

1,123

$150.870

-

-

-

Vyrian

USA . 2,285 parts In-Stock

1+ parts

$158.810

100+ parts

-

1k+ parts

-

10k+ parts

-

2,285

$158.810

-

-

-

DigiKey Marketplace

USA . 6,779 parts In-Stock

1+ parts

$165.160

100+ parts

-

1k+ parts

-

10k+ parts

-

6,779

$165.160

-

-

-

Mil-Aero Solutions, Inc.

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8

-

-

-

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SPM Sales

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 623 parts In-Stock

1+ parts

$0.382

100+ parts

-

1k+ parts

-

10k+ parts

$0.366

623

$0.382

-

-

$0.366

Northwest PG Solutions

USA . 1,631 parts In-Stock

1+ parts

$0.420

100+ parts

-

1k+ parts

-

10k+ parts

$0.370

1,631

$0.420

-

-

$0.370

Corohmni

South Africa . 106 parts In-Stock

1+ parts

$53.123

100+ parts

-

1k+ parts

-

10k+ parts

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106

$53.123

-

-

-

Parana Technologies

USA . 768 parts In-Stock

1+ parts

$71.994

100+ parts

-

1k+ parts

-

10k+ parts

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768

$71.994

-

-

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DigiPath Technology Company

USA . 2,234 parts In-Stock

1+ parts

$79.274

100+ parts

$72.932

1k+ parts

-

10k+ parts

-

2,234

$79.274

$72.932

-

-

ChromeModa Solutions

Germany . 3,134 parts In-Stock

1+ parts

$80.892

100+ parts

$66.331

1k+ parts

-

10k+ parts

-

3,134

$80.892

$66.331

-

-

IDEA Electronic Components Group

UK . 1,421 parts In-Stock

1+ parts

$80.892

100+ parts

$76.847

1k+ parts

$72.803

10k+ parts

-

1,421

$80.892

$76.847

$72.803

-

Corphita

USA . 1,549 parts In-Stock

1+ parts

$142.929

100+ parts

-

1k+ parts

-

10k+ parts

-

1,549

$142.929

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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EMSNET (Excess)

USA . 1,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,298

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-

-

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Microchip USA

USA . 172 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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172

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments GC2011A-PB DSP Peripheral. Crafted with precision and expertise, this innovative solution offers unparalleled performance in a wide range of applications. Whether you're designing digital filters or implementing low-power modes, this product is your go-to choice for seamless integration and optimal results. Elevate your projects to new heights with the quality and reliability that only Texas Instruments can deliver. Explore the possibilities and experience the ultimate in value and efficiency with the GC2011A-PB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP peripherals, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy PCB integration and saves space, making the product suitable for compact designs.

Maximum Supply Voltage: 3.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the product.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, making the product ideal for compact electronic devices.

Output Data Bus Width: 16

A wider output data bus allows for faster data transfer and processing, enhancing the performance of the DSP peripherals.

Power Supplies (V): 3.3

A stable power supply of 3.3V ensures reliable operation of the DSP peripherals under various operating conditions.

No. of Terminals: 160

The high number of terminals provides ample connectivity options, allowing for versatile integration in different electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style offers increased reliability and signal integrity, making the product suitable for high-performance applications.

Minimum Supply Voltage: 3.1 V

With a minimum supply voltage of 3.1V, the DSP peripherals can operate effectively even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

DSP Peripherals GC2011A-PB attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

106 MHz

External Data Bus Width:

12

JESD-30 Code:

S-PBGA-B160

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

160

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Data Bus Width:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA160,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

3.5 V

Minimum Supply Voltage:

3.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

GC2011A-PB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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