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SN74LS261NP1

Texas Instruments

SN74LS261NP1 by Texas Instruments

SN74LS261NP1 by Texas Instruments is a DSP peripheral IC with 16 terminals in an in-line package. It operates b/w 0°C to 70°C, suitable for commercial applications. This TTL technology multiplier is designed for through-hole mounting at a terminal pitch of 2.54mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,738 parts In-Stock

1+ parts

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8,738

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Digiode

USA . 4,206 parts In-Stock

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4,206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 880 parts In-Stock

1+ parts

$14.571

100+ parts

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880

$14.571

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One Stop Electronics

USA . 684 parts In-Stock

1+ parts

$24.000

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684

$24.000

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Parana Technologies

USA . 1,261 parts In-Stock

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$37.420

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1,261

$37.420

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Corohmni

South Africa . 2,164 parts In-Stock

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$37.921

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2,164

$37.921

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DigiPath Technology Company

USA . 561 parts In-Stock

1+ parts

$41.204

100+ parts

$37.908

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561

$41.204

$37.908

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ChromeModa Solutions

Germany . 3,157 parts In-Stock

1+ parts

$42.045

100+ parts

$34.477

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3,157

$42.045

$34.477

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IDEA Electronic Components Group

UK . 2,349 parts In-Stock

1+ parts

$42.045

100+ parts

$39.943

1k+ parts

$37.840

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2,349

$42.045

$39.943

$37.840

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Corphita

USA . 4,691 parts In-Stock

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4,691

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Overview

Unlock the power of digital signal processing with the SN74LS261NP1 by Texas Instruments. Renowned for their quality and innovation, Texas Instruments delivers cutting-edge DSP peripherals that revolutionize the way you process data. Whether you're a professional in the audio industry or a hobbyist looking to enhance your projects, this multiplier IC offers unmatched performance and reliability. Trust Texas Instruments to bring you the best in technology, providing you with the tools you need to succeed in any application. Experience the difference with the SN74LS261NP1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to heat, making it suitable for a wide range of operating temperatures.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board.

No. of Terminals: 16

Having 16 terminals allows for multiple connections, enabling the peripheral to interface with other components effectively.

Package Style: IN-LINE

In-line package style makes it easy to integrate this peripheral into existing setups without requiring major layout changes.

Maximum Operating Temperature: 70 °C

Operating at up to 70°C ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C means this peripheral can be used in a variety of environments.

Terminal Position: DUAL

Dual terminal position allows for flexibility in interfacing with external devices and peripherals.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance in standard operating conditions.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Being a multiplier DSP peripheral, this product offers enhanced processing capabilities for mathematical operations.

Technology: TTL

TTL technology provides fast and reliable digital signal processing, making this peripheral suitable for real-time applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections on a circuit board, ensuring stability during operation and maintenance.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this peripheral is compatible with standard PCB layouts, simplifying integration into existing designs.

Technical Specifications

DSP Peripherals SN74LS261NP1 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74LS261NP1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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