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M27HC68PFP-40

STMicroelectronics

M27HC68PFP-40 by STMicroelectronics

STMicroelectronics M27HC68PFP-40 is a DSP Peripheral IC with 68 terminals, CMOS technology, and 5V nominal voltage. It is used for digital filtering applications in commercial-grade environments with a temperature range of 0 to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,528 parts In-Stock

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3,528

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Vyrian

USA . 2,917 parts In-Stock

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2,917

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Anansix

USA . 1,605 parts In-Stock

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1,605

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,873 parts In-Stock

1+ parts

$42.788

100+ parts

-

1k+ parts

$38.509

10k+ parts

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1,873

$42.788

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$38.509

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Corohmni

South Africa . 569 parts In-Stock

1+ parts

$55.196

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569

$55.196

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MKK Technologies

India . 1,874 parts In-Stock

1+ parts

$80.461

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1,874

$80.461

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DigiPath Technology Company

USA . 1,874 parts In-Stock

1+ parts

$80.461

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1,874

$80.461

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Corphita

USA . 3,362 parts In-Stock

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3,362

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Parana Technologies

USA . 2,264 parts In-Stock

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$51.160

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2,264

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$51.160

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Overview

Elevate your digital signal processing capabilities with the M27HC68PFP-40 by STMicroelectronics. Crafted from high-quality ceramic materials, this DSP peripheral offers superior performance in a compact square package. Ideal for applications requiring precision and efficiency, this chip carrier boasts a nominal supply voltage of 5V and maximum operating temperature of 70 °C. Trust in STMicroelectronics' reputation for excellence and unlock new possibilities in your projects with the M27HC68PFP-40.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal properties and is highly reliable, ensuring optimal performance and durability of the product.

Surface Mount: YES

Surface mount technology makes the product easy to install on circuit boards, saving space and reducing production costs.

Power Supplies (V): 5

Operating at a voltage of 5V is common for many electronic systems, ensuring compatibility and ease of integration.

No. of Terminals: 68

Having a higher number of terminals allows for more connectivity options and functionality in the product.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: 0 °C

The ability to operate at lower temperatures ensures reliability and performance in various working conditions.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the product efficient and reliable.

Maximum Supply Current: 300 mA

With a maximum supply current of 300mA, the product can deliver sufficient power for its operations, ensuring consistent performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies system design.

Technical Specifications

DSP Peripherals M27HC68PFP-40 attributes and parameters. Explore more DSP Peripherals devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e0

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC68,.95SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Maximum Supply Current:

300 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

M27HC68PFP-40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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