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CALS29818DW

Texas Instruments

CALS29818DW by Texas Instruments

CALS29818DW by Texas Instruments is a DSP peripheral with 24 terminals in a small outline package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. Featuring pipeline register technology and Gull Wing terminals, this device is ideal for high-performance signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,214 parts In-Stock

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2,214

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Digiode

USA . 1,827 parts In-Stock

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1,827

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Distributors (Availability)

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Native Components

USA . 890 parts In-Stock

1+ parts

$1.983

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890

$1.983

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Northwest PG Solutions

USA . 1,977 parts In-Stock

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$2.181

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1,977

$2.181

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AZTECH Wire

Italy . 471 parts In-Stock

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$5.489

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471

$5.489

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One Stop Electronics

USA . 1,366 parts In-Stock

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$18.000

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1,366

$18.000

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Parana Technologies

USA . 417 parts In-Stock

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$20.911

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$21.103

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417

$20.911

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$21.103

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IDEA Electronic Components Group

UK . 323 parts In-Stock

1+ parts

$23.496

100+ parts

$22.321

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$21.146

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323

$23.496

$22.321

$21.146

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ChromeModa Solutions

Germany . 152 parts In-Stock

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$23.496

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$19.267

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152

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$19.267

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Corohmni

South Africa . 1,893 parts In-Stock

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$63.975

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$63.975

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DigiPath Technology Company

USA . 1,697 parts In-Stock

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$21.184

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$21.184

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Corphita

USA . 1,249 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the CALS29818DW by Texas Instruments. Known for their superior quality and innovation, Texas Instruments has produced a top-of-the-line DSP Peripheral that offers unmatched performance and reliability. From signal processing to data acquisition, this versatile device is a game-changer in various applications. Experience the value and benefits of seamless integration, increased efficiency, and enhanced functionality that the CALS29818DW brings to your projects. Upgrade to Texas Instruments and elevate your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient, saving time and effort during setup.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, optimizing layout and design.

No. of Terminals: 24

Having 24 terminals provides flexibility in connectivity options and allows for multiple connections to other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the board, which is essential for compact electronic devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability and performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in a wide range of environments, making the product versatile.

Terminal Position: DUAL

Dual terminal position provides redundancy and increases reliability in connections, reducing the risk of signal loss.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product is suitable for standard commercial applications, ensuring compatibility with most systems.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

DSP peripheral with pipeline register technology offers high-speed data processing capabilities, making it ideal for real-time applications.

Technology: TTL

TTL technology ensures compatibility with a wide range of devices and systems, ensuring seamless integration into existing setups.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and secure connections, reducing the risk of disconnection or signal loss.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for high-density mounting, enabling more components to be packed closely together on the board.

Technical Specifications

DSP Peripherals CALS29818DW attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

CALS29818DW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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