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DF1706EG4

Texas Instruments

DF1706EG4 by Texas Instruments

DF1706EG4 by Texas Instruments is a DSP Peripheral with 28 terminals, operating at 3.3V. It features a CMOS technology, peak reflow temp of 260C, and max supply current of 45mA. Ideal for digital filtering applications due to its small outline package and nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,315 parts In-Stock

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3,315

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Digiode

USA . 88 parts In-Stock

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88

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Distributors (Availability)

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AZTECH Wire

Italy . 599 parts In-Stock

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$8.828

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599

$8.828

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Corohmni

South Africa . 644 parts In-Stock

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$20.563

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One Stop Electronics

USA . 1,527 parts In-Stock

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$33.000

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Parana Technologies

USA . 1,401 parts In-Stock

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$62.267

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$62.267

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ChromeModa Solutions

Germany . 6,934 parts In-Stock

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$69.963

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$57.370

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6,934

$69.963

$57.370

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IDEA Electronic Components Group

UK . 256 parts In-Stock

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$69.963

100+ parts

$66.465

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$62.967

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256

$69.963

$66.465

$62.967

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DigiPath Technology Company

USA . 988 parts In-Stock

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$63.079

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Northwest PG Solutions

USA . 364 parts In-Stock

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$3.404

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$3.404

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Corphita

USA . 285 parts In-Stock

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Native Components

USA . 205 parts In-Stock

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$3.369

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Overview

Unlock the power of innovation with the DF1706EG4 by Texas Instruments, a cutting-edge DSP Peripheral that sets new industry standards. With a commitment to quality and excellence, Texas Instruments delivers unmatched performance and reliability in every product. Ideal for a wide range of applications, this versatile device offers customers unparalleled value and benefits, making it the top choice for those seeking advanced digital filtering solutions. Trust Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring longevity and stability of the product.

Surface Mount: YES

Easy to install and saves space on the PCB, making it suitable for compact designs.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility and compatibility with different power sources.

Package Shape: RECTANGULAR

Traditional shape that is easy to handle and integrate into existing systems.

Power Supplies (V): 3.3

Standard power supply voltage for easy integration and compatibility with other components.

No. of Terminals: 28

Sufficient terminals for connecting to external devices and peripherals, offering versatility in usage.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact size with small outline and shrink pitch for space-saving and efficient PCB layout.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels, increasing energy efficiency and reducing power consumption.

Maximum Seated Height: 2 mm

Low profile design for slim and sleek product form factor.

Width: 5.3 mm

Narrow width for easy placement and fitting in tight spaces.

Terminal Position: DUAL

Dual terminal position for enhanced stability and secure connection.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure soldering and reliability during assembly.

Peripheral IC Type: DSP PERIPHERAL, DIGITAL FILTER

Specialized DSP peripheral with digital filter capabilities for advanced signal processing applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and strong mechanical support.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance and operation of the product.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise connections and signal routing.

Technical Specifications

DSP Peripherals DF1706EG4 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

DSP Peripherals

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

DF1706EG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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