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5962-9220501MLX

Texas Instruments

5962-9220501MLX by Texas Instruments

Texas Instruments' 5962-9220501MLX is a MIL-STD-883 compliant DSP peripheral with CMOS technology. It operates b/w -55 to 125 °C, with supply voltage range of 4.5V to 5.5V and max current of 21.8mA. Ideal for military applications requiring high-performance pipeline register peripherals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,109 parts In-Stock

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Digiode

USA . 1,914 parts In-Stock

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One Stop Electronics

USA . 788 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 805 parts In-Stock

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$14.186

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805

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Parana Technologies

USA . 1,030 parts In-Stock

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$63.936

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DigiPath Technology Company

USA . 1,505 parts In-Stock

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$70.401

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ChromeModa Solutions

Germany . 970 parts In-Stock

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$71.838

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$58.907

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970

$71.838

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IDEA Electronic Components Group

UK . 489 parts In-Stock

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$71.838

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$68.246

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$64.654

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Corohmni

South Africa . 5,222 parts In-Stock

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Corphita

USA . 3,867 parts In-Stock

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Northwest PG Solutions

USA . 1,805 parts In-Stock

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Native Components

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Overview

Elevate your projects to the next level with the 5962-9220501MLX by Texas Instruments. Crafted with precision and expertise, this DSP Peripheral offers unparalleled performance and reliability. Ideal for military-grade applications, this product boasts a wide operating temperature range and low power consumption. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your systems with the 5962-9220501MLX and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures high durability and reliability in various operating conditions.

Maximum Supply Voltage: 5.5 V

Supports a high supply voltage range, making it suitable for applications requiring higher power consumption.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 standards ensures quality and reliability in military and aerospace applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and mounting on circuit boards.

No. of Terminals: 24

Sufficient number of terminals for connecting to other components in the system.

Package Style (Meter): IN-LINE

In-line package style allows for compact and space-saving integration in electronic devices.

Minimum Supply Voltage: 4.5 V

Supports a low minimum supply voltage, offering flexibility in power management and efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures functionality in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and enhances connectivity in the system.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures operation in harsh environments without failure.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

Specialized DSP peripheral with pipeline register design for efficient data processing and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for advanced digital applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections on circuit boards.

Maximum Supply Current: 21.8 mA

Low maximum supply current consumption for efficient power usage.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent performance in various applications.

Technical Specifications

DSP Peripherals 5962-9220501MLX attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

JESD-30 Code:

R-GDIP-T24

Low Power Mode:

NO

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Current:

21.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

5962-9220501MLX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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