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GC3011-CQ

Texas Instruments

GC3011-CQ by Texas Instruments

GC3011-CQ by Texas Instruments is a DSP Peripheral with 12-bit output data bus width, operating at up to 80 MHz clock frequency. It features low power mode and operates b/w -25°C to 85°C. Ideal for digital filtering applications due to its CMOS technology and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,919 parts In-Stock

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Digiode

USA . 320 parts In-Stock

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Inventory MP

USA . 5 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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Native Components

USA . 856 parts In-Stock

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$0.054

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$0.051

856

$0.054

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$0.051

AZTECH Wire

Italy . 721 parts In-Stock

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$16.728

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Corohmni

South Africa . 1,886 parts In-Stock

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$19.544

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One Stop Electronics

USA . 1,340 parts In-Stock

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$24.000

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Parana Technologies

USA . 1,166 parts In-Stock

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$51.785

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ChromeModa Solutions

Germany . 4,485 parts In-Stock

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$58.185

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$47.712

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

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$58.185

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$55.276

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$52.366

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DigiPath Technology Company

USA . 1,563 parts In-Stock

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$52.460

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Northwest PG Solutions

USA . 631 parts In-Stock

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Corphita

USA . 145 parts In-Stock

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Perfect Parts

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Overview

Elevate your DSP applications with the GC3011-CQ by Texas Instruments. Crafted with precision and expertise, this high-quality DSP peripheral offers unparalleled performance and reliability. Whether you're working on digital filtering or signal processing projects, this innovative product delivers exceptional value and benefits. Experience seamless integration, enhanced functionality, and unmatched efficiency with the GC3011-CQ. Upgrade your technology toolkit today and unleash the full potential of your projects with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent durability and reliability for long-term performance.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 6 V

Can handle higher voltages, providing versatility in different applications.

Package Shape: RECTANGULAR

Space-efficient design that fits well in compact electronic devices.

Output Data Bus Width: 12

Wide data bus allows for fast and efficient data transfer, enhancing overall performance.

Power Supplies (V): 5

Stable power supply for consistent operation and reliable functionality.

No. of Terminals: 100

Sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): FLATPACK

Compact package style that helps save space in electronic devices.

Minimum Supply Voltage: 3 V

Can operate at lower voltages, allowing for energy-efficient performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for demanding environments.

Minimum Operating Temperature: -25 °C

Capable of operating in cold temperatures, making it versatile for various conditions.

Terminal Position: QUAD

Quad terminal position for easy and secure connections.

Width: 14 mm

Slim and compact width for fitting into tight spaces.

External Data Bus Width: 12

Consistent data bus width for seamless data transmission.

Maximum Clock Frequency: 80 MHz

High clock frequency for fast data processing and efficient operation.

Length: 20 mm

Optimal length for accommodating components and peripherals in electronic systems.

Peripheral IC Type: DSP PERIPHERAL, DIGITAL FILTER

Specialized IC type for digital signal processing and filtering applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Maximum Supply Current: 210 mA

Handles high current loads, ensuring stable power delivery.

Nominal Supply Voltage: 5 V

Stable and standard voltage supply for consistent performance.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for compact layout and space-saving design.

Low Power Mode: YES

Efficient low power mode for energy-saving operation.

Technical Specifications

DSP Peripherals GC3011-CQ attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

12

JESD-30 Code:

R-CQFP-G100

Length:

20 mm

Low Power Mode:

YES

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Data Bus Width:

12

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

GC3011-CQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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