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ADSP-1102TG

Analog Devices

ADSP-1102TG by Analog Devices

Analog Devices' ADSP-1102TG is a DSP Peripheral with 16-bit output data bus width, suitable for military applications. It features a ceramic, metal-sealed co-fired package body material and operates in temperatures ranging from -55°C to 125°C. The device has 68 terminals, a grid array package style, and uses CMOS technology with a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,878 parts In-Stock

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Digiode

USA . 574 parts In-Stock

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574

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Northwest PG Solutions

USA . 841 parts In-Stock

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$3.017

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841

$3.017

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One Stop Electronics

USA . 1,325 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 678 parts In-Stock

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$14.934

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678

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Semicontronic

India . 318 parts In-Stock

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$32.000

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$31.200

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$31.040

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318

$32.000

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$31.040

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Parana Technologies

USA . 1,598 parts In-Stock

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$34.819

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$32.382

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1,598

$34.819

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$32.382

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IDEA Electronic Components Group

UK . 1,202 parts In-Stock

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$37.440

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$35.568

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$37.440

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DigiPath Technology Company

USA . 1,318 parts In-Stock

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$58.406

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$56.070

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$56.070

1,318

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$56.070

Corohmni

South Africa . 413 parts In-Stock

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$84.145

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413

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Native Components

USA . 951 parts In-Stock

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$2.661

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Corphita

USA . 853 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the ADSP-1102TG by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-of-the-line DSP peripherals that are trusted by professionals worldwide. This product offers endless possibilities for applications in various industries, providing customers with unmatched value and benefits. Upgrade your systems with the ADSP-1102TG and discover the difference in quality and efficiency it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability, making this product suitable for harsh environments.

Output Data Bus Width: 16

A wider output data bus width allows for faster data transfer speeds and better performance in data processing applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand intense heat conditions without compromising performance.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed operation, making it energy-efficient and efficient for various applications.

Nominal Supply Voltage: 5 V

The 5V supply voltage ensures compatibility with standard power sources and offers stable performance for the product.

Technical Specifications

DSP Peripherals ADSP-1102TG attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

Boundary Scan:

NO

External Data Bus Width:

16

JESD-30 Code:

S-CPGA-P68

JESD-609 Code:

e0

Length:

27.81 mm

Low Power Mode:

NO

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

16

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

4.17 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

27.81 mm

Peripheral IC Type:

Trade Compliance

ADSP-1102TG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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