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SN74LS384NP1

Texas Instruments

SN74LS384NP1 by Texas Instruments

SN74LS384NP1 by Texas Instruments is a DSP peripheral IC with 16 terminals in an in-line package. It operates b/w 0°C to 70°C, suitable for commercial applications. This TTL technology multiplier is designed for through-hole mounting at a pitch of 2.54mm, making it ideal for various digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,987 parts In-Stock

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8,987

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Digiode

USA . 1,890 parts In-Stock

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1,890

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Distributors (Availability)

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AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$16.308

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779

$16.308

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One Stop Electronics

USA . 761 parts In-Stock

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$17.000

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761

$17.000

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Parana Technologies

USA . 593 parts In-Stock

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$21.761

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$22.221

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593

$21.761

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$22.221

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DigiPath Technology Company

USA . 1,595 parts In-Stock

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$23.962

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1,595

$23.962

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IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$24.451

100+ parts

$23.228

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$22.006

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789

$24.451

$23.228

$22.006

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ChromeModa Solutions

Germany . 77 parts In-Stock

1+ parts

$24.451

100+ parts

$20.050

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77

$24.451

$20.050

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Corohmni

South Africa . 989 parts In-Stock

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$31.761

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989

$31.761

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Corphita

USA . 4,078 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the SN74LS384NP1 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers cutting-edge DSP peripherals like this multiplier that are essential for a wide range of applications. From audio processing to telecommunications, this product provides unmatched performance and precision. Experience seamless integration and enhanced functionality with the SN74LS384NP1, making it the ideal choice for any project requiring high-quality signal processing capabilities. Elevate your designs with Texas Instruments technology and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

Allows for easy integration into existing systems or circuits due to standard shape and size.

No. of Terminals: 16

Provides multiple connection points for various inputs and outputs, increasing versatility and functionality.

Package Style (Meter): IN-LINE

Saves space and allows for efficient placement within a circuit or system.

Maximum Operating Temperature: 70 °C

Can operate effectively in various environmental conditions, making it suitable for a range of applications.

Minimum Operating Temperature: 0 °C

Ensures reliable performance even in low-temperature environments, increasing product reliability.

Terminal Position: DUAL

Allows for multiple connections at each terminal, enabling complex signal processing and data manipulation.

Temperature Grade: COMMERCIAL

Designed for standard commercial applications, making it suitable for a wide range of industries.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Specifically designed for digital signal processing tasks, providing efficient and accurate calculations for signal manipulation.

Technology: TTL

Uses Transistor-Transistor Logic technology for reliable and high-speed data processing, ensuring quick response times.

Terminal Form: THROUGH-HOLE

Enables easy soldering and secure connections to a circuit board, reducing the risk of disconnection or signal loss.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for seamless integration into existing circuit designs and facilitates easy connection of external components.

Technical Specifications

DSP Peripherals SN74LS384NP1 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74LS384NP1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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