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ADSP-3201TG/+

Analog Devices

ADSP-3201TG/+ by Analog Devices

Analog Devices' ADSP-3201TG/+ is a MIL-grade DSP peripheral IC with 144 pins in a ceramic grid array package. Operating from -55°C to 125°C, it features CMOS technology and serves applications requiring high-speed signal processing and multiplication tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,827 parts In-Stock

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Digiode

USA . 179 parts In-Stock

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179

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Distributors (Availability)

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Native Components

USA . 958 parts In-Stock

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$0.363

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-

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$0.348

958

$0.363

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$0.348

Northwest PG Solutions

USA . 774 parts In-Stock

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$0.399

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$0.352

774

$0.399

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$0.352

AZTECH Wire

Italy . 315 parts In-Stock

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$6.600

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315

$6.600

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Parana Technologies

USA . 2,154 parts In-Stock

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$15.488

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$14.404

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$15.488

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IDEA Electronic Components Group

UK . 2,121 parts In-Stock

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$16.654

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$15.821

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$15.821

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$15.821

$15.821

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Semicontronic

India . 1,313 parts In-Stock

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$21.000

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$20.475

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$20.370

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1,313

$21.000

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$20.370

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Corohmni

South Africa . 281 parts In-Stock

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$21.894

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DigiPath Technology Company

USA . 1,580 parts In-Stock

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$25.980

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$24.941

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$24.941

1,580

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$24.941

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$24.941

One Stop Electronics

USA . 749 parts In-Stock

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$29.000

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749

$29.000

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Corphita

USA . 728 parts In-Stock

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728

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Overview

Unlock the power of high-performance signal processing with the ADSP-3201TG/+ by Analog Devices. As a leader in the industry, Analog Devices delivers top-quality products that exceed expectations. Ideal for applications in DSP peripherals, this product offers unparalleled value and benefits to customers. Whether you're looking to enhance audio systems, improve communication devices, or optimize industrial automation, the ADSP-3201TG/+ provides the cutting-edge technology and reliability you need to stay ahead. Elevate your projects with the trusted quality and innovative solutions of Analog Devices.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal management and high reliability, making this product suitable for harsh environments.

Package Shape: SQUARE

Square shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 144

Large number of terminals allow for versatile connectivity and interfacing with other components.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and reliability under demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

DSP Peripherals ADSP-3201TG/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P144

JESD-609 Code:

e0

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

ADSP-3201TG/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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