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SN74HC266DT

Texas Instruments

SN74HC266DT by Texas Instruments

XNOR GATE; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.812

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

$0.783

1k+ parts

$0.650

10k+ parts

$0.579

9,500

-

$0.783

$0.650

$0.579

DigiKey

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.980

10k+ parts

-

9,500

-

-

$0.980

-

Verical

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.812

10k+ parts

$0.724

4,500

-

-

$0.812

$0.724

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,158 parts In-Stock

1+ parts

$0.444

100+ parts

-

1k+ parts

-

10k+ parts

-

4,158

$0.444

-

-

-

Nova Conductors

Japan . 96 parts In-Stock

1+ parts

$0.462

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$0.462

-

-

-

Vyrian

USA . 6,553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,553

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,239 parts In-Stock

1+ parts

$0.397

100+ parts

-

1k+ parts

-

10k+ parts

-

7,239

$0.397

-

-

-

Corphita

USA . 4,219 parts In-Stock

1+ parts

$0.420

100+ parts

-

1k+ parts

-

10k+ parts

-

4,219

$0.420

-

-

-

Argo Parts USA

USA . 3,121 parts In-Stock

1+ parts

$0.462

100+ parts

-

1k+ parts

-

10k+ parts

$0.448

3,121

$0.462

-

-

$0.448

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.462

100+ parts

$0.453

1k+ parts

-

10k+ parts

-

500

$0.462

$0.453

-

-

Continental Prestige Electronics

USA . 55 parts In-Stock

1+ parts

$0.462

100+ parts

-

1k+ parts

-

10k+ parts

$0.453

55

$0.462

-

-

$0.453

Parana Technologies

USA . 2,106 parts In-Stock

1+ parts

$29.424

100+ parts

$2,732.492

1k+ parts

$26.482

10k+ parts

-

2,106

$29.424

$2,732.492

$26.482

-

DigiPath Technology Company

USA . 1,704 parts In-Stock

1+ parts

$32.400

100+ parts

-

1k+ parts

-

10k+ parts

-

1,704

$32.400

-

-

-

ChromeModa Solutions

Germany . 4,899 parts In-Stock

1+ parts

$33.061

100+ parts

$27.110

1k+ parts

-

10k+ parts

-

4,899

$33.061

$27.110

-

-

IDEA Electronic Components Group

UK . 434 parts In-Stock

1+ parts

$33.061

100+ parts

$31.408

1k+ parts

$29.755

10k+ parts

-

434

$33.061

$31.408

$29.755

-

Technical Specifications

Logic Gates SN74HC266DT attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

155 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74HC266DT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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