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SN74ACT7205L50RJ

Texas Instruments

SN74ACT7205L50RJ by Texas Instruments

SN74ACT7205L50RJ by Texas Instruments is a FIFO chip with 8Kx9 organization, operating at 15 MHz clock frequency and 65 ns cycle time. It is designed for parallel operation in commercial temperature grade applications, featuring a memory density of 73728 bits and max supply voltage of 5.5V.

Median Price

$18.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,272 parts In-Stock

1+ parts

-

100+ parts

$14.560

1k+ parts

$13.030

10k+ parts

$12.260

3,272

-

$14.560

$13.030

$12.260

DigiKey

USA . 3,272 parts In-Stock

1+ parts

-

100+ parts

$19.160

1k+ parts

-

10k+ parts

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3,272

-

$19.160

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Verical

USA . 2,016 parts In-Stock

1+ parts

-

100+ parts

$18.200

1k+ parts

$16.288

10k+ parts

$15.325

2,016

-

$18.200

$16.288

$15.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,679 parts In-Stock

1+ parts

$15.380

100+ parts

-

1k+ parts

-

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1,679

$15.380

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-

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Vyrian

USA . 2,294 parts In-Stock

1+ parts

$16.190

100+ parts

-

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2,294

$16.190

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DigiKey Marketplace

USA . 3,272 parts In-Stock

1+ parts

-

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3,272

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,805 parts In-Stock

1+ parts

$4.369

100+ parts

-

1k+ parts

$4.788

10k+ parts

-

1,805

$4.369

-

$4.788

-

DigiPath Technology Company

USA . 17 parts In-Stock

1+ parts

$4.811

100+ parts

-

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-

10k+ parts

-

17

$4.811

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-

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ChromeModa Solutions

Germany . 1,474 parts In-Stock

1+ parts

$4.909

100+ parts

$4.025

1k+ parts

-

10k+ parts

-

1,474

$4.909

$4.025

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-

IDEA Electronic Components Group

UK . 1,332 parts In-Stock

1+ parts

$4.909

100+ parts

-

1k+ parts

$4.418

10k+ parts

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1,332

$4.909

-

$4.418

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Ampacity Inc.

Singapore . 2,985 parts In-Stock

1+ parts

$13.760

100+ parts

-

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-

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2,985

$13.760

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Corphita

USA . 4,165 parts In-Stock

1+ parts

$14.571

100+ parts

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10k+ parts

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4,165

$14.571

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Component Stockers USA

USA . 5,602 parts In-Stock

1+ parts

$16.540

100+ parts

$15.550

1k+ parts

$14.060

10k+ parts

-

5,602

$16.540

$15.550

$14.060

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Overview

Experience seamless data transfer with the SN74ACT7205L50RJ FIFO by Texas Instruments, a premium quality chip carrier that guarantees efficient performance in a wide range of applications. With a cycle time of just 65ns and a maximum clock frequency of 15MHz, this asynchronous FIFO device ensures speedy data handling without compromising on reliability. Ideal for commercial-grade projects, this parallel memory IC boasts a memory density of 73728 bits and a memory width of 9, offering customers unbeatable value and unmatched benefits in their electronic designs.

Feature Benefit Bullets

Cycle Time: 65 ns

This fast cycle time ensures quick data transfer and processing, making this FIFO a reliable and efficient choice for high-speed applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operation allows for independent data transfers without the need for a synchronized clock signal, providing flexibility and simplicity in system integration.

Maximum Clock Frequency (fCLK): 15 MHz

With a high maximum clock frequency, this FIFO can handle fast data processing and synchronization, making it suitable for demanding applications that require rapid data transfer speeds.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing the reliability and efficiency of this FIFO in various electronic systems.

Memory Density: 73728 bit

The high memory density of this FIFO allows for storing a large amount of data in a compact space, making it a space-efficient choice for applications with limited board space.

Technical Specifications

FIFO SN74ACT7205L50RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

Maximum Clock Frequency (fCLK):

15 MHz

Cycle Time:

65 ns

JESD-30 Code:

R-PQCC-J32

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7205L50RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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