Loading...

CD74HC40105MTE4

Texas Instruments

CD74HC40105MTE4 by Texas Instruments

CD74HC40105MTE4 by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 10 MHz clock frequency. It operates in synchronous mode with a cycle time of 500 ns. Ideal for military applications requiring fast data storage and retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,257

-

-

-

-

Digiode

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,040

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 240 parts In-Stock

1+ parts

$0.029

100+ parts

-

1k+ parts

-

10k+ parts

$0.028

240

$0.029

-

-

$0.028

Parana Technologies

USA . 1,605 parts In-Stock

1+ parts

$3.756

100+ parts

-

1k+ parts

$4.253

10k+ parts

-

1,605

$3.756

-

$4.253

-

ChromeModa Solutions

Germany . 3,056 parts In-Stock

1+ parts

$4.220

100+ parts

$3.460

1k+ parts

-

10k+ parts

-

3,056

$4.220

$3.460

-

-

IDEA Electronic Components Group

UK . 959 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

$3.798

10k+ parts

-

959

$4.220

-

$3.798

-

AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$15.566

100+ parts

-

1k+ parts

-

10k+ parts

-

347

$15.566

-

-

-

Ampacity Inc.

Singapore . 1,564 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,564

$22.000

-

-

-

One Stop Electronics

USA . 1,635 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,635

$28.000

-

-

-

DigiPath Technology Company

USA . 2,165 parts In-Stock

1+ parts

-

100+ parts

$3.805

1k+ parts

-

10k+ parts

-

2,165

-

$3.805

-

-

Corphita

USA . 1,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,084

-

-

-

-

Northwest PG Solutions

USA . 802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

802

-

-

-

-

Overview

Elevate your projects with the CD74HC40105MTE4 by Texas Instruments, a top-tier FIFO memory IC that promises exceptional quality and reliability. Designed for seamless operation in synchronous mode with a fast cycle time of 500 ns, this small outline package offers military-grade temperature tolerance and a wide voltage range of 2V to 6V. Ideal for applications requiring efficient data storage and retrieval, this IC boasts a memory density of 64 bits and a parallel interface for quick access. Trust Texas Instruments to deliver cutting-edge technology that enhances your designs and ensures optimal performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures long-term reliability and ease of handling.

Cycle Time: 500 ns

Fast cycle time enables quick data retrieval and processing.

Operating Mode: SYNCHRONOUS

Synchronous operation enables precise timing and coordination with other system components.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient performance and power consumption.

Maximum Operating Temperature: 125 °C

Wide temperature range allows for reliable operation in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Output Enable: YES

Output enable feature provides flexibility in controlling data output.

Technical Specifications

FIFO CD74HC40105MTE4 attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

2250 ns

Maximum Clock Frequency (fCLK):

10 MHz

Cycle Time:

500 ns

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16X4

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC40105MTE4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20