Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SN74ABT3611-30PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates synchronously at 5V and has a commercial temperature grade. Ideal for applications requiring fast data storage and retrieval in parallel processing systems.
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Corphita
PLASTIC/EPOXY material ensures durability and reliability for long-term use.
Fast cycle time of 30 ns provides efficient data transfer speed.
Synchronous operation ensures reliable and coordinated data transfer.
Stable supply voltage of 5V ensures consistent performance.
Ample terminals provide connectivity options for various devices.
Wide operating temperature range of up to 70°C allows for use in different environments.
BICMOS technology combines the advantages of both Bipolar and CMOS technologies for improved performance.
Output enable feature allows for on/off control of data output for flexibility.
FIFO SN74ABT3611-30PQ attributes and parameters. Explore more FIFO devices from Texas Instruments
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Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
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Package Style (Meter):
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Power Supplies (V):
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SN74ABT3611-30PQ Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Transys Electronics
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Daco Semiconductor
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
DP83848IVVX/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
IDT72801L10PF
Integrated Device Technology
IDT72801L10PF FIFO by Integrated Device Technology features a cycle time of 10 ns and operates at a max clock frequency of 100 MHz. With an organization of 256X9, it is suitable for applications requiring fast data processing and storage in commercial-grade environments. This FIFO supports parallel operation with a memory density of 2304 bit, making it ideal for high-speed data buffering tasks.
72V3632L10PFG8
Renesas Electronics
Renesas Electronics' 72V3632L10PFG8 FIFO operates synchronously with a cycle time of 10 ns and a clock frequency up to 100 MHz. With a memory density of 18432 bit, it is ideal for applications requiring fast data processing such as networking equipment and telecommunications systems. The device features a low profile flatpack package with 120 terminals and operates within the commercial temperature grade range of 0-70°C.
72V273L7-5BCGI8
The Renesas Electronics 72V273L7-5BCGI8 is a FIFO memory with 16Kx18 organization, operating at 133.3 MHz clock frequency and 7.5 ns cycle time. It is suitable for industrial applications requiring fast data processing and synchronous operation in a compact grid array package.
SN54LS228J
Texas Instruments
SN54LS228J by Texas Instruments is a 16x4 FIFO memory IC with 64-bit memory density. It operates in parallel mode with a cycle time of 100ns and max access time of 80ns. Ideal for military-grade applications due to its operating temperature range of -55°C to 125°C.
SN74ACT3651-15PCB
SN74ACT3651-15PCB by Texas Instruments is a FIFO with 2Kx36 organization, operating at 66.7MHz with 15ns cycle time. It features a memory density of 73728 bits and is ideal for applications requiring bi-directional FIFO memory ICs with synchronous operation.
72V241L10PFG8
The Renesas Electronics 72V241L10PFG8 FIFO operates in synchronous mode with a cycle time of 10 ns and a clock frequency of 100 MHz. It has a memory density of 36864 bit, suitable for applications requiring fast data access such as networking equipment and telecommunications devices.
SN74ACT2235-40FNR
SN74ACT2235-40FNR by Texas Instruments is a FIFO chip with 1Kx9 organization, 40ns cycle time, and 35ns access time. It operates at 5V with output enable feature for parallel applications. Ideal for systems requiring fast data transfer and storage in commercial temperature environments.
SN74ABT3611-20PQ
SN74ABT3611-20PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at 5V and has a max access time of 12 ns. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT72231L-50RJ
SN74ACT72231L-50RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, 50ns cycle time, and 20MHz clock frequency. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT7819-10PHR
SN74ABT7819-10PHR by Texas Instruments is a 512x18 FIFO with 10ns cycle time, operating at 5V. It features synchronous operation, parallel interface, and output enable function. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7204L15NP
SN74ACT7204L15NP by Texas Instruments is a FIFO memory with 4Kx9 organization, 40 MHz clock frequency, and 25 ns cycle time. It operates at 5V with a max supply current of 120mA. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7202-50N
SN74ACT7202-50N by Texas Instruments is a FIFO with 1KX9 organization, 65 ns cycle time, and 15 MHz max clock frequency. Ideal for applications requiring fast synchronous operation in commercial temperature grades.
CD74HCT40105M96
CD74HCT40105M96 by Texas Instruments is a 16x4 FIFO memory IC with 64-bit memory density and 10 MHz max clock frequency. Operating at -55 to 125 °C, it's ideal for military-grade applications requiring fast data storage and retrieval. With synchronous operation and output enable feature, this CMOS technology-based device offers reliable parallel data processing in compact small outline packaging.
IDT7204L12JG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
IDT72V2105L10PFG8
IDT72V2105L10PFG8 by Renesas Electronics is a 256Kx18 FIFO with 10ns cycle time, operating at 3.3V. It features synchronous operation and GULL WING terminals in a low profile FLATPACK package. Ideal for applications requiring fast data transfer and memory management in commercial-grade environments.
7201LA35JG8
FIFOs;
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
SN74ACT7204L35NP
SN74ACT7204L35NP by Texas Instruments is a 4Kx9 FIFO with CMOS technology. It operates asynchronously at 5V, has a memory density of 36864 bits, and supports parallel data transfer. This rectangular package with 28 terminals is ideal for commercial applications requiring fast and efficient data storage and retrieval.
CD74HC40105ME4
CD74HC40105ME4 by Texas Instruments is a FIFO memory IC with 16x4 organization, 64-bit memory density, and 10 MHz clock frequency. It operates in synchronous mode with a cycle time of 500 ns and has a max access time of 2250 ns. Ideal for military-grade applications requiring fast data storage and retrieval.
SN74ACT2235-60PAG
SN74ACT2235-60PAG by Texas Instruments is a FIFO memory IC with 1Kx9 organization, operating at 60 ns cycle time and 16.7 MHz clock frequency. It features a 64-terminal flatpack package suitable for commercial temperature grades. Ideal for applications requiring bi-directional parallel memory with output enable functionality.
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LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
SN74V293-6PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
SN74V245-15PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Organization: 4KX18;
SN74V293-7PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G80;
SN74V245-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH;
SN74V235-7PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN74V245-7PAG
SN74V245-7PAG by Texas Instruments is a FIFO with 4Kx18 organization, operating at 166MHz. It features a cycle time of 7.5ns, synchronous mode, and 3-state output characteristics. This memory IC type is suitable for applications requiring fast data transfer and parallel operation in commercial temperature environments.
SN74V215-7PAG
SN74V215-7PAG by Texas Instruments is a FIFO with 512x18 organization, operating at 133 MHz clock frequency. It features a cycle time of 7.5 ns and operates at a nominal voltage of 3.3 V. This device is ideal for applications requiring fast data storage and retrieval in synchronous mode with 3-STATE output characteristics.
SN74ACT7201LA-25NP
SN74ACT7201LA-25NP by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its CMOS technology and 3-STATE output characteristics.
SN74ACT7202LA25NP
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
SN74V263-6PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74V215-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; JESD-609 Code: e4;
SN74V245-15PAGEP
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN74V215-20PAG
SN74V215-20PAG by Texas Instruments is a FIFO memory IC with 512x18 organization and 512 words code. It operates synchronously with a cycle time of 20 ns and has a max clock frequency of 133 MHz. This IC is commonly used in applications that require high-speed data buffering and storage.
SN74V283-15PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .015 Amp;
SN74ALVC7803-40DL
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
SN74ABT7819A-15PN
SN74ABT7819A-15PN by Texas Instruments is a 512KX18 BI-DIRECTIONAL FIFO with a cycle time of 15 ns and max clock frequency of 67 MHz. It is commonly used in applications requiring high-speed data buffering and storage.
SN74ABT7819A-30PH
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Organization: 512KX18;
SN74V235-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Surface Mount: YES;
SN74ABT7819A-10PN
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Cycle Time: 10 ns;
SN74ABT7819A-15PH
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
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