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SMJ320C31HFGM50

Texas Instruments

SMJ320C31HFGM50 by Texas Instruments

SMJ320C31HFGM50 by Texas Instruments is a 32-bit DSP with 2K RAM words, 32-bit external data bus width, and max clock frequency of 50 MHz. Ideal for military applications due to MIL-PRF-38535 screening level, it features low power mode and barrel shifter for efficient signal processing.

Median Price

$2,575.170

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 410 parts In-Stock

1+ parts

$1,701.850

100+ parts

-

1k+ parts

-

10k+ parts

-

410

$1,701.850

-

-

-

Rochester

USA . 6 parts In-Stock

1+ parts

$2,575.170

100+ parts

$2,420.660

1k+ parts

$2,266.150

10k+ parts

-

6

$2,575.170

$2,420.660

$2,266.150

-

DigiKey

USA . 6 parts In-Stock

1+ parts

$3,218.960

100+ parts

-

1k+ parts

-

10k+ parts

-

6

$3,218.960

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,690 parts In-Stock

1+ parts

$1,616.758

100+ parts

-

1k+ parts

-

10k+ parts

-

3,690

$1,616.758

-

-

-

Vyrian

USA . 6,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,595

-

-

-

-

DigiKey Marketplace

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,227 parts In-Stock

1+ parts

$1.000

100+ parts

$1.000

1k+ parts

$1.000

10k+ parts

$1.000

2,227

$1.000

$1.000

$1.000

$1.000

Corohmni

South Africa . 2,438 parts In-Stock

1+ parts

$35.692

100+ parts

-

1k+ parts

-

10k+ parts

-

2,438

$35.692

-

-

-

Parana Technologies

USA . 625 parts In-Stock

1+ parts

$60.773

100+ parts

$5,643.673

1k+ parts

$54.695

10k+ parts

-

625

$60.773

$5,643.673

$54.695

-

DigiPath Technology Company

USA . 2,021 parts In-Stock

1+ parts

$66.918

100+ parts

$61.565

1k+ parts

-

10k+ parts

-

2,021

$66.918

$61.565

-

-

ChromeModa Solutions

Germany . 318 parts In-Stock

1+ parts

$68.284

100+ parts

$55.993

1k+ parts

-

10k+ parts

-

318

$68.284

$55.993

-

-

IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$68.284

100+ parts

$64.870

1k+ parts

$61.456

10k+ parts

-

93

$68.284

$64.870

$61.456

-

Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$1,446.570

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$1,446.570

-

-

-

Corphita

USA . 2,738 parts In-Stock

1+ parts

$1,531.665

100+ parts

-

1k+ parts

-

10k+ parts

-

2,738

$1,531.665

-

-

-

Overview

Unleash the power of cutting-edge technology with the SMJ320C31HFGM50 by Texas Instruments. As a leading manufacturer of Digital Signal Processors (DSPs), Texas Instruments delivers top-notch quality and performance in every product. Ideal for a wide range of applications, this DSP offers customers unparalleled value and benefits. With advanced features like a maximum clock frequency of 50 MHz and low power mode, the SMJ320C31HFGM50 provides fast and efficient processing capabilities. Elevate your projects to new heights with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures reliable and high-quality packaging, making this product durable and long-lasting.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for increased flexibility in system design and operation, accommodating a wider range of applications.

Internal Bus Architecture: MULTIPLE

Having a multiple internal bus architecture enhances data processing and communication efficiency within the DSP, leading to improved overall performance.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency, this DSP can handle complex signal processing tasks with speed and accuracy, making it suitable for demanding applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environments, making this DSP ideal for rugged applications where temperature fluctuations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a dedicated digital signal processor with other peripheral ICs integrated, this product offers comprehensive signal processing capabilities, making it a versatile choice for various applications.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C31HFGM50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQFP-F132

JESD-609 Code:

e0

Length:

24.19 mm

Low Power Mode:

YES

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

1

No. of Terminals:

132

No. of Timers:

2

On Chip Data RAM Width:

32

On Chip Program ROM Width:

0

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

TPAK132,2.0SQ,25

Package Shape:

Package Style (Meter):

FLATPACK, GUARD RING

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2K

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.92 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.64 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.19 mm

Peripheral IC Type:

Trade Compliance

SMJ320C31HFGM50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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