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SMJ320C31GFAM50

Texas Instruments

SMJ320C31GFAM50 by Texas Instruments

The Texas Instruments SMJ320C31GFAM50 is a 32-bit DSP with 5V supply, 50MHz clock frequency, and MIL-PRF-38535 screening. Ideal for military applications due to its -55 to 125 °C operating temperature range, it features a 2K RAM and supports floating-point format with low power mode.

Median Price

$2,926.325

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40 parts In-Stock

1+ parts

$2,341.060

100+ parts

$2,200.600

1k+ parts

$2,060.130

10k+ parts

-

40

$2,341.060

$2,200.600

$2,060.130

-

Verical

USA . 40 parts In-Stock

1+ parts

$2,926.325

100+ parts

$2,750.750

1k+ parts

$2,575.162

10k+ parts

-

40

$2,926.325

$2,750.750

$2,575.162

-

DigiKey

USA . 40 parts In-Stock

1+ parts

$2,926.330

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$2,926.330

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,944 parts In-Stock

1+ parts

$2,245.496

100+ parts

-

1k+ parts

-

10k+ parts

-

4,944

$2,245.496

-

-

-

Vyrian

USA . 8,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,399

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,339 parts In-Stock

1+ parts

$1.000

100+ parts

$1.000

1k+ parts

$1.000

10k+ parts

$1.000

1,339

$1.000

$1.000

$1.000

$1.000

Parana Technologies

USA . 569 parts In-Stock

1+ parts

$19.437

100+ parts

-

1k+ parts

$19.449

10k+ parts

-

569

$19.437

-

$19.449

-

IDEA Electronic Components Group

UK . 2,173 parts In-Stock

1+ parts

$21.839

100+ parts

$20.747

1k+ parts

$19.655

10k+ parts

-

2,173

$21.839

$20.747

$19.655

-

ChromeModa Solutions

Germany . 806 parts In-Stock

1+ parts

$21.839

100+ parts

$17.908

1k+ parts

-

10k+ parts

-

806

$21.839

$17.908

-

-

Corohmni

South Africa . 5,174 parts In-Stock

1+ parts

$24.550

100+ parts

-

1k+ parts

-

10k+ parts

-

5,174

$24.550

-

-

-

Corphita

USA . 696 parts In-Stock

1+ parts

$2,127.312

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$2,127.312

-

-

-

Component Stockers USA

USA . 85 parts In-Stock

1+ parts

$2,378.790

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$2,378.790

-

-

-

DigiPath Technology Company

USA . 1,464 parts In-Stock

1+ parts

-

100+ parts

$19.690

1k+ parts

-

10k+ parts

-

1,464

-

$19.690

-

-

Assy Fe

Spain . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the Texas Instruments SMJ320C31GFAM50 Digital Signal Processor. Manufactured by industry leader Texas Instruments, this DSP offers unparalleled performance and reliability for a wide range of applications. From military to industrial use, this versatile processor delivers exceptional value and benefits to customers seeking top-notch processing capabilities. Experience the advantage of precision engineering and superior quality with the SMJ320C31GFAM50 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired package body material provides high durability and reliability, making it suitable for harsh operating environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options and ensures stable operation under varying voltage conditions.

Bit Size: 32

With a 32-bit architecture, this digital signal processor offers high computational power and precision in processing digital signals.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this DSP suitable for use in rugged military applications where extreme temperatures may be encountered.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data transfer efficiency and enables faster processing speeds for complex signal processing tasks.

Format: FLOATING POINT

The floating point format allows for high precision and accuracy in numerical computations, making this DSP suitable for applications that require complex mathematical operations.

Barrel Shifter: YES

The presence of a barrel shifter enables efficient handling of data shifts and rotations, improving overall performance and flexibility in data manipulation.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C31GFAM50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P141

JESD-609 Code:

e0

Length:

26.925 mm

Low Power Mode:

YES

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

1

No. of Terminals:

141

No. of Timers:

2

On Chip Data RAM Width:

32

On Chip Program ROM Width:

0

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

SPGA141,19X19

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2K

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

26.925 mm

Peripheral IC Type:

Trade Compliance

SMJ320C31GFAM50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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