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SM32C6416TGLZA8EP

Texas Instruments

SM32C6416TGLZA8EP by Texas Instruments

SM32C6416TGLZA8EP by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and 100 MHz clock frequency. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode.

Median Price

$320.600

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 110 parts In-Stock

1+ parts

$272.850

100+ parts

$256.480

1k+ parts

$240.110

10k+ parts

-

110

$272.850

$256.480

$240.110

-

DigiKey

USA . 110 parts In-Stock

1+ parts

$329.470

100+ parts

-

1k+ parts

-

10k+ parts

-

110

$329.470

-

-

-

Verical

USA . 86 parts In-Stock

1+ parts

-

100+ parts

$320.600

1k+ parts

$300.137

10k+ parts

-

86

-

$320.600

$300.137

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,686 parts In-Stock

1+ parts

$300.960

100+ parts

-

1k+ parts

-

10k+ parts

-

4,686

$300.960

-

-

-

DigiKey Marketplace

USA . 110 parts In-Stock

1+ parts

$329.470

100+ parts

-

1k+ parts

-

10k+ parts

-

110

$329.470

-

-

-

Vyrian

USA . 6,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,680

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,621 parts In-Stock

1+ parts

$15.194

100+ parts

-

1k+ parts

-

10k+ parts

-

2,621

$15.194

-

-

-

Parana Technologies

USA . 507 parts In-Stock

1+ parts

$18.061

100+ parts

-

1k+ parts

$18.208

10k+ parts

-

507

$18.061

-

$18.208

-

DigiPath Technology Company

USA . 127 parts In-Stock

1+ parts

$19.887

100+ parts

-

1k+ parts

-

10k+ parts

-

127

$19.887

-

-

-

ChromeModa Solutions

Germany . 5,663 parts In-Stock

1+ parts

$20.293

100+ parts

$16.640

1k+ parts

-

10k+ parts

-

5,663

$20.293

$16.640

-

-

IDEA Electronic Components Group

UK . 609 parts In-Stock

1+ parts

$20.293

100+ parts

$19.278

1k+ parts

$18.264

10k+ parts

-

609

$20.293

$19.278

$18.264

-

Ampacity Inc.

Singapore . 102 parts In-Stock

1+ parts

$269.280

100+ parts

-

1k+ parts

-

10k+ parts

-

102

$269.280

-

-

-

Corphita

USA . 4,555 parts In-Stock

1+ parts

$285.120

100+ parts

-

1k+ parts

-

10k+ parts

-

4,555

$285.120

-

-

-

Microchip USA

USA . 382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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382

-

-

-

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Kepictronics

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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172

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Overview

Experience top-notch performance with the Texas Instruments SM32C6416TGLZA8EP Digital Signal Processor. Manufactured by a trusted industry leader, this DSP offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Unlock new possibilities and achieve superior results with the SM32C6416TGLZA8EP from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Surface Mount: YES

Allows for easy integration onto PCBs without the need for additional hardware.

Maximum Supply Voltage: 1.24 V

Efficient power consumption and reduced risk of damage from high voltages.

Address Bus Width: 23

Allows for efficient memory addressing and data retrieval.

Package Shape: SQUARE

Optimal form factor for space-saving integration into electronic devices.

Bit Size: 32

High processing capacity for handling complex digital signals.

Power Supplies (V): 1.2,3.3

Supports multiple voltage options for flexibility in different system configurations.

No. of Terminals: 532

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high-density packaging for efficient use of PCB space.

Minimum Supply Voltage: 1.16 V

Ensures stable performance even at low voltage levels.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures for reliable operation in industrial environments.

Minimum Operating Temperature: -40 °C

Ideal for operating in extreme cold conditions without loss of performance.

Terminal Position: BOTTOM

Facilitates easy PCB mounting and soldering.

Maximum Seated Height: 3.25 mm

Low profile design for space-constrained applications.

RAM Words: 16384

Sufficient memory for processing and storing digital signal data.

Width: 23 mm

Compact form factor for versatile installation options.

Boundary Scan: YES

Allows for testing and debugging of the DSP during production and operation.

External Data Bus Width: 64

Wide data bus for high-speed communication with external devices.

Maximum Clock Frequency: 100 MHz

High clock speed for quick signal processing and data manipulation.

Internal Bus Architecture: MULTIPLE

Efficient data flow within the DSP for improved performance.

Length: 23 mm

Symmetrical dimensions for uniform layout on PCBs.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments with wide temperature ranges.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral support for extended functionality and connectivity.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Facilitates reliable solder connections for robust electrical connections.

Nominal Supply Voltage: 1.2 V

Stable voltage supply for consistent performance and reliability.

Terminal Pitch: 0.8 mm

Fine pitch for precise placement and soldering on PCBs.

Format: FIXED POINT

Optimized format for efficient processing of digital signal data.

Low Power Mode: YES

Enables energy-efficient operation for extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6416TGLZA8EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SM32C6416TGLZA8EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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