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SM320VC5416PGE16EP

Texas Instruments

SM320VC5416PGE16EP by Texas Instruments

Texas Instruments SM320VC5416PGE16EP is a 16-bit DSP with 1.65V max supply voltage, 23-bit address bus width, and 20MHz clock frequency. Ideal for industrial applications requiring low power mode, it features 131072 RAM words and on-chip data RAM width of 16 bits.

Median Price

$58.660

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$58.660

1k+ parts

$52.490

10k+ parts

$49.400

1

-

$58.660

$52.490

$49.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,085 parts In-Stock

1+ parts

$49.542

100+ parts

-

1k+ parts

-

10k+ parts

-

3,085

$49.542

-

-

-

Vyrian

USA . 4,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,174

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 900 parts In-Stock

1+ parts

$15.050

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$15.050

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$22.525

100+ parts

$20.498

1k+ parts

$18.470

10k+ parts

-

2,000

$22.525

$20.498

$18.470

-

Microchip USA

USA . 1,718 parts In-Stock

1+ parts

$26.750

100+ parts

$26.370

1k+ parts

$26.180

10k+ parts

$25.990

1,718

$26.750

$26.370

$26.180

$25.990

Corphita

USA . 2,544 parts In-Stock

1+ parts

$46.935

100+ parts

-

1k+ parts

-

10k+ parts

-

2,544

$46.935

-

-

-

Corohmni

South Africa . 175 parts In-Stock

1+ parts

$64.138

100+ parts

-

1k+ parts

-

10k+ parts

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175

$64.138

-

-

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Parana Technologies

USA . 1,007 parts In-Stock

1+ parts

$69.797

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$69.797

-

-

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DigiPath Technology Company

USA . 498 parts In-Stock

1+ parts

$76.856

100+ parts

-

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498

$76.856

-

-

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ChromeModa Solutions

Germany . 830 parts In-Stock

1+ parts

$78.424

100+ parts

$64.308

1k+ parts

-

10k+ parts

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830

$78.424

$64.308

-

-

IDEA Electronic Components Group

UK . 121 parts In-Stock

1+ parts

$78.424

100+ parts

$74.503

1k+ parts

$70.582

10k+ parts

-

121

$78.424

$74.503

$70.582

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Perfect Parts

USA . 20 parts In-Stock

1+ parts

-

100+ parts

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20

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Overview

Experience unparalleled performance and reliability with the Texas Instruments SM320VC5416PGE16EP Digital Signal Processor. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers a product that exceeds expectations in the field of DSPs. This versatile processor is ideal for a wide range of applications, from audio processing to telecommunications. Offering high-speed processing, low power consumption, and a compact design, this DSP provides unmatched value and efficiency for customers looking to take their projects to the next level. Choose Texas Instruments for industry-leading innovation and exceptional performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic devices.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.65 V

Efficient power utilization leading to lower energy consumption.

On Chip Data RAM Width: 16

Provides high-speed data processing capabilities.

Address Bus Width: 23

Supports a large memory space for complex signal processing tasks.

Package Shape: SQUARE

Facilitates easy mounting and alignment on PCBs.

Bit Size: 16

Suitable for handling digital signal processing tasks efficiently.

Power Supplies (V): 1.6,3.3

Versatile voltage inputs for compatibility with various power sources.

No. of Terminals: 144

Enhanced connectivity options for external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Optimal packaging design for space-constrained applications.

Minimum Supply Voltage: 1.55 V

Provides flexibility in power input requirements.

Maximum Operating Temperature: 100 °C

Suitable for industrial environments with high temperature variations.

No. of External Interrupts: 4

Provides support for external events and real-time processing.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions.

Technical Specifications

Digital Signal Processors (DSPs) SM320VC5416PGE16EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SM320VC5416PGE16EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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