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PCI6620GHK

Texas Instruments

PCI6620GHK by Texas Instruments

PCI6620GHK by Texas Instruments is a Bus Controller with 32-bit Address and External Data Bus Width. It operates at 48 MHz clock frequency, supporting PCI bus compatibility for data transfer rate up to 132 MBps. Ideal for PCMCIA applications due to its low profile grid array package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,993 parts In-Stock

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Digiode

USA . 1,380 parts In-Stock

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1,380

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Distributors (Availability)

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One Stop Electronics

USA . 423 parts In-Stock

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$16.000

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423

$16.000

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AZTECH Wire

Italy . 509 parts In-Stock

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$17.168

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Corohmni

South Africa . 968 parts In-Stock

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$25.520

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968

$25.520

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Parana Technologies

USA . 762 parts In-Stock

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$74.759

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762

$74.759

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ChromeModa Solutions

Germany . 2,263 parts In-Stock

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$83.999

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$68.879

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2,263

$83.999

$68.879

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IDEA Electronic Components Group

UK . 1,965 parts In-Stock

1+ parts

$83.999

100+ parts

$79.799

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$75.599

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1,965

$83.999

$79.799

$75.599

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Component Stockers USA

USA . 511 parts In-Stock

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$99.990

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Corphita

USA . 4,555 parts In-Stock

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DigiPath Technology Company

USA . 473 parts In-Stock

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$75.733

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473

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Microchip USA

USA . 442 parts In-Stock

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Overview

Discover the world of seamless connectivity with the Texas Instruments PCI6620GHK Bus Controller. Crafted with precision and quality, this innovative product offers reliable performance and a wide range of applications in various industries. With Texas Instruments' reputation for excellence, you can trust in the value and benefits that the PCI6620GHK brings to your projects. Experience enhanced data transfer rates and efficient power supplies, all in a sleek package that ensures ease of installation. Elevate your systems with the PCI6620GHK and unlock endless possibilities in connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount capability facilitates easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2 V

The maximum supply voltage of 2V ensures compatibility with a wide range of power sources.

Address Bus Width: 32

A wide address bus width of 32 allows for efficient data transfer and communication between various components.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board.

Power Supplies (V): 1.8,3.3,5

The availability of multiple power supply options allows for versatile compatibility with different systems.

No. of Terminals: 288

A high number of terminals enables connectivity with multiple components, enhancing the overall functionality of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package styles make the product suitable for applications requiring precise integration and high performance.

Minimum Supply Voltage: 1.6 V

The minimum supply voltage of 1.6V ensures reliable operation even with low power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows for stable performance even under demanding conditions.

Maximum Data Transfer Rate: 132 MBps

The high data transfer rate of 132 MBps enables fast and efficient communication within the system.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation in various environmental conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connection processes on the circuit board.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm helps in achieving a slim and compact overall product design.

Width: 16 mm

The compact width of 16mm allows for efficient space utilization on the circuit board.

External Data Bus Width: 32

The external data bus width of 32 enhances data transfer speed and efficiency between the product and external components.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz enables fast processing and operation of the product.

Length: 16 mm

The compact length of 16mm contributes to a space-saving design and efficient placement on the circuit board.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard environmental conditions.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

The peripheral IC type of bus controller and PCMCIA enhances the product's compatibility and functionality with various systems and devices.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high speed, and reliability.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, enhancing the overall durability of the product.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V ensures stable and efficient operation in various applications.

Bus Compatibility: PCI

The bus compatibility with PCI allows for easy integration and communication with other PCI-compliant devices.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm enables high-density mounting and efficient use of space on the circuit board.

Technical Specifications

Bus Controllers PCI6620GHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

132 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B288

Length:

16 mm

No. of Terminals:

288

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.6 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI6620GHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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