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PCI6515GHK

Texas Instruments

PCI6515GHK by Texas Instruments

PCI6515GHK by Texas Instruments is a Bus Controller with 32-bit Address Bus Width and 132 MBps Data Transfer Rate. It operates at 3-3.6 V, has a max clock frequency of 33.33 MHz, and is suitable for PCI bus compatibility in commercial-grade applications like PCMCIA peripherals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,983 parts In-Stock

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Digiode

USA . 287 parts In-Stock

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287

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AZTECH Wire

Italy . 201 parts In-Stock

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$14.806

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201

$14.806

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Parana Technologies

USA . 1,377 parts In-Stock

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$23.173

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$23.807

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$23.173

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$23.807

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DigiPath Technology Company

USA . 2,205 parts In-Stock

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$25.516

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$23.475

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$25.516

$23.475

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ChromeModa Solutions

Germany . 4,422 parts In-Stock

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$26.037

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$21.350

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$26.037

$21.350

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IDEA Electronic Components Group

UK . 1,121 parts In-Stock

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$26.037

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$24.735

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$23.433

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$26.037

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$23.433

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One Stop Electronics

USA . 206 parts In-Stock

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$29.000

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206

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Corohmni

South Africa . 763 parts In-Stock

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$31.037

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Lixinc

USA . 13,527 parts In-Stock

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Corphita

USA . 2,088 parts In-Stock

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Microchip USA

USA . 140 parts In-Stock

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Overview

Upgrade your system with the Texas Instruments PCI6515GHK Bus Controller. With a reputation for excellence in manufacturing, Texas Instruments delivers high-quality products that provide reliable performance. This versatile component is perfect for a wide range of applications, offering customers seamless data transfer at impressive speeds of up to 132 MBps. Experience the value and benefits of the PCI6515GHK as it enhances your system's capabilities and efficiency. Trust Texas Instruments for top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to physical damage, making this product suitable for rugged environments.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, increasing the versatility of the product.

Address Bus Width: 32

The 32-bit address bus width enables efficient data transmission and processing, making the product suitable for high-performance applications.

Package Shape: SQUARE

The square package shape facilitates easy and secure mounting on the PCB, ensuring stable connections and reliable performance.

Power Supplies (V): 3.3,3.3/5

The multiple power supply options provide flexibility in powering the device, allowing for compatibility with various systems and configurations.

No. of Terminals: 257

The high number of terminals allows for multiple connections and interfaces, enhancing the functionality and connectivity of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient use of space on the PCB and enables high-density mounting of components.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources, reducing power consumption.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range enables the product to withstand elevated temperatures, making it suitable for industrial and automotive applications.

Maximum Data Transfer Rate: 132 MBps

The high data transfer rate allows for fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures reliable performance even in cold environments, making the product versatile for use in various conditions.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure soldering connections, ensuring stable electrical connections and long-term reliability.

Maximum Seated Height: 1.4 mm

The low maximum seated height enables a compact and space-efficient design, ideal for applications with limited space availability.

Width: 16 mm

The compact width dimensions enable easy integration into PCB designs, saving space and allowing for efficient use of available board space.

External Data Bus Width: 32

The 32-bit external data bus width allows for high-speed data transfer and processing, enhancing system performance and efficiency.

Maximum Clock Frequency: 33.33 MHz

The high maximum clock frequency enables fast data processing and communication, making the product suitable for high-speed applications.

Length: 16 mm

The compact length dimensions enable easy integration into PCB designs, saving space and allowing for efficient use of available board space.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard temperature ranges, making the product suitable for a wide range of commercial applications.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

The peripheral IC type of bus controller and PCMCIA ensures compatibility with a variety of devices and systems, making the product versatile for different applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Terminal Form: BALL

The ball terminal form allows for secure and reliable soldering connections, ensuring stable electrical connections and long-term durability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures compatibility with standard power sources, making the product easy to integrate into existing systems and designs.

Bus Compatibility: PCI

The PCI bus compatibility allows for easy integration into PCI-based systems, ensuring seamless communication and operation with other PCI devices.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density mounting of components on the PCB, saving space and allowing for efficient use of available board space.

Moisture Sensitivity Level (MSL): 3

The MSL 3 moisture sensitivity level indicates that the product can withstand some exposure to moisture without compromising performance, increasing reliability in diverse environments.

Technical Specifications

Bus Controllers PCI6515GHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33.33 MHz

Maximum Data Transfer Rate:

132 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B257

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI6515GHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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