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PCI6612GHK

Texas Instruments

PCI6612GHK by Texas Instruments

PCI6612GHK by Texas Instruments is a 216-terminal bus controller with 32-bit address and external data bus width. It operates at 24.576 MHz clock frequency, supporting a max data transfer rate of 132 MBps. Ideal for PCI bus compatibility and PCMCIA peripheral ICs in commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,325 parts In-Stock

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Digiode

USA . 1,904 parts In-Stock

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AZTECH Wire

Italy . 716 parts In-Stock

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$6.140

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One Stop Electronics

USA . 1,362 parts In-Stock

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$18.000

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Corohmni

South Africa . 1,073 parts In-Stock

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Parana Technologies

USA . 1,276 parts In-Stock

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$26.936

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$30.239

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IDEA Electronic Components Group

UK . 700 parts In-Stock

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$30.265

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$28.752

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$27.238

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$30.265

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ChromeModa Solutions

Germany . 538 parts In-Stock

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$30.265

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$24.817

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A-Z Elektronik GmbH

Germany . 4,749 parts In-Stock

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DigiPath Technology Company

USA . 1,241 parts In-Stock

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$27.287

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Kepictronics

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Corphita

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Overview

Unlock seamless data transfer and enhanced performance with the Texas Instruments PCI6612GHK Bus Controller. Crafted with precision and expertise, this high-quality product offers customers unparalleled value and reliability. Perfect for a wide range of applications, this innovative device is designed to optimize data flow and streamline operations. Experience the benefits of advanced technology with the PCI6612GHK - the ultimate solution for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus controller.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources.

Address Bus Width: 32

Supports high-speed data transfer and communication between devices.

Package Shape: SQUARE

Optimizes space utilization on circuit boards.

No. of Terminals: 216

Provides a high level of connectivity options for peripheral devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Offers a compact and efficient design for integrated circuits.

Minimum Supply Voltage: 3 V

Ensures stable performance at lower power input levels.

Maximum Operating Temperature: 70 °C

Ensures reliable operation under varying environmental conditions.

Maximum Data Transfer Rate: 132 MBps

Enables fast and efficient data exchange between connected devices.

Minimum Operating Temperature: 0 °C

Designed to function in a wide range of temperature environments.

Terminal Position: BOTTOM

Facilitates easy connection to other components on the circuit board.

Maximum Seated Height: 1.4 mm

Allows for a low-profile and compact form factor.

Width: 16 mm

Optimal size for fitting into standard electronic devices.

External Data Bus Width: 32

Supports high-speed data transfer between the bus controller and external devices.

Maximum Clock Frequency: 24.576 MHz

Enables fast processing and communication within the bus controller.

Length: 16 mm

Compact design for efficient placement on circuit boards.

Temperature Grade: COMMERCIAL

Suitable for use in commercial-grade electronic products.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

Specifically designed for bus control in PCMCIA devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Terminal Form: BALL

Facilitates easy and secure soldering onto circuit boards.

Nominal Supply Voltage: 3.3 V

Optimal operating voltage for stable performance.

Bus Compatibility: PCI

Compatible with PCI bus architecture for seamless integration.

Terminal Pitch: 0.8 mm

Provides precise spacing for connection to other components.

Drive Interface Standard: IEEE1394; IEEE1394A

Supports high-speed data transfer with IEEE1394 and IEEE1394A devices.

Technical Specifications

Bus Controllers PCI6612GHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

24.576 MHz

Maximum Data Transfer Rate:

132 MBps

Drive Interface Standard:

IEEE1394; IEEE1394A

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B216

Length:

16 mm

No. of Terminals:

216

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI6612GHK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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