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PCI6515AGHK

Texas Instruments

PCI6515AGHK by Texas Instruments

PCI6515AGHK by Texas Instruments is a Bus Controller with 32-bit Address Bus Width, 132 MBps Data Transfer Rate, and 33 MHz Clock Frequency. It is used in PCMCIA applications for PCI bus compatibility, featuring a low profile grid array package style.

Median Price

$12.900

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,945 parts In-Stock

1+ parts

-

100+ parts

$10.320

1k+ parts

$9.230

10k+ parts

$8.690

11,945

-

$10.320

$9.230

$8.690

DigiKey

USA . 11,945 parts In-Stock

1+ parts

-

100+ parts

$13.580

1k+ parts

-

10k+ parts

-

11,945

-

$13.580

-

-

Verical

USA . 11,045 parts In-Stock

1+ parts

-

100+ parts

$12.900

1k+ parts

$11.537

10k+ parts

$10.863

11,045

-

$12.900

$11.537

$10.863

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 172 parts In-Stock

1+ parts

$10.887

100+ parts

-

1k+ parts

-

10k+ parts

-

172

$10.887

-

-

-

Vyrian

USA . 4,347 parts In-Stock

1+ parts

$11.460

100+ parts

-

1k+ parts

-

10k+ parts

-

4,347

$11.460

-

-

-

Cyclops Electronics Ltd

UK . 489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

489

-

-

-

-

Connect4Technologies Inc.

Canada . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,611 parts In-Stock

1+ parts

$10.314

100+ parts

-

1k+ parts

-

10k+ parts

-

3,611

$10.314

-

-

-

Component Stockers USA

USA . 27,354 parts In-Stock

1+ parts

$11.560

100+ parts

$10.860

1k+ parts

$9.820

10k+ parts

$9.820

27,354

$11.560

$10.860

$9.820

$9.820

Parana Technologies

USA . 1,214 parts In-Stock

1+ parts

$46.977

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

$46.977

-

-

-

DigiPath Technology Company

USA . 1,385 parts In-Stock

1+ parts

$51.727

100+ parts

$47.589

1k+ parts

-

10k+ parts

-

1,385

$51.727

$47.589

-

-

IDEA Electronic Components Group

UK . 2,370 parts In-Stock

1+ parts

$52.783

100+ parts

$50.144

1k+ parts

$47.505

10k+ parts

-

2,370

$52.783

$50.144

$47.505

-

ChromeModa Solutions

Germany . 1,509 parts In-Stock

1+ parts

$52.783

100+ parts

$43.282

1k+ parts

-

10k+ parts

-

1,509

$52.783

$43.282

-

-

Corohmni

South Africa . 734 parts In-Stock

1+ parts

$54.565

100+ parts

-

1k+ parts

-

10k+ parts

-

734

$54.565

-

-

-

Overview

Experience seamless data transfer and superior performance with the Texas Instruments PCI6515AGHK Bus Controller. Crafted with precision using high-quality materials, this product is designed to meet the demands of various applications in the commercial sector. With a maximum data transfer rate of 132 MBps and a low profile package style, this bus controller guarantees efficiency and reliability. Trust Texas Instruments for cutting-edge technology that delivers value and innovation to customers looking for top-notch solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Address Bus Width: 32

The 32-bit address bus width allows for efficient communication and data transfer between components.

Package Shape: SQUARE

The square package shape simplifies the design and layout of the circuit board, optimizing space and heat dissipation.

Power Supplies (V): 3.3,3.3/5

Support for multiple power supply voltages provides flexibility in system configuration and operation.

No. of Terminals: 257

The high number of terminals allows for a wide range of connectivity options and features in the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch enhances electrical performance, signal integrity, and thermal management.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power utilization and compatibility with energy-efficient systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the product to perform reliably in demanding and harsh environments.

Maximum Data Transfer Rate: 132 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in a wide range of temperature conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies assembly and installation of the product on circuit boards.

Maximum Seated Height: 1.4 mm

The low maximum seated height helps reduce the overall profile of the product, making it suitable for slim and compact designs.

Width: 16 mm

The compact width of the product allows for easy integration into various system designs with space constraints.

External Data Bus Width: 32

The 32-bit external data bus width ensures high-speed data transfer and efficient communication between external components.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency enables fast processing and data transfer speeds in the system.

Length: 16 mm

The compact length of the product provides flexibility in placement and integration within the system.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial operating environments.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

The peripheral IC type of bus controller for PCMCIA ensures seamless connectivity and control of peripheral devices in the system.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high reliability, and compatibility with modern digital systems.

Terminal Form: BALL

The use of ball terminal form simplifies installation and ensures secure electrical connections in the system.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures consistent and reliable operation of the product within specified voltage limits.

Bus Compatibility: PCI

The PCI bus compatibility ensures versatile connectivity and interoperability with a wide range of systems and devices.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and efficient use of space on the circuit board.

Technical Specifications

Bus Controllers PCI6515AGHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

132 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B257

Length:

16 mm

No. of Terminals:

257

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI6515AGHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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