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PCI6515AZGK

Texas Instruments

PCI6515AZGK by Texas Instruments

PCI6515AZGK by Texas Instruments is a 257-terminal bus controller with 32-bit address and external data bus width. It operates at up to 33 MHz clock frequency, supporting PCI bus compatibility. Ideal for PCMCIA applications, it features a low-profile grid array package with a max data transfer rate of 132 MBps.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,906 parts In-Stock

1+ parts

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4,906

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Digiode

USA . 1,096 parts In-Stock

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1,096

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,383 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,383

$8.000

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Corohmni

South Africa . 21 parts In-Stock

1+ parts

$16.713

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21

$16.713

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AZTECH Wire

Italy . 709 parts In-Stock

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$18.605

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709

$18.605

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Parana Technologies

USA . 445 parts In-Stock

1+ parts

$25.200

100+ parts

$2,340.235

1k+ parts

$22.680

10k+ parts

-

445

$25.200

$2,340.235

$22.680

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DigiPath Technology Company

USA . 2,374 parts In-Stock

1+ parts

$27.749

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2,374

$27.749

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ChromeModa Solutions

Germany . 6,334 parts In-Stock

1+ parts

$28.315

100+ parts

$23.218

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6,334

$28.315

$23.218

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IDEA Electronic Components Group

UK . 458 parts In-Stock

1+ parts

$28.315

100+ parts

$26.899

1k+ parts

$25.484

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458

$28.315

$26.899

$25.484

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Corphita

USA . 2,327 parts In-Stock

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2,327

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Overview

Experience superior performance and reliability with the Texas Instruments PCI6515AZGK, a cutting-edge bus controller that boasts top-notch quality and precision engineering. This innovative product is perfect for a wide range of applications, offering seamless integration and high-speed data transfer rates of up to 132 MBps. With its advanced technology and durable construction, the PCI6515AZGK delivers exceptional value and benefits to customers, making it the ideal choice for those seeking optimal performance and efficiency in their electronic devices. Choose Texas Instruments for unmatched quality and performance in bus controllers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications such as laptops or tablets.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with various power sources, providing flexibility in system design.

Address Bus Width: 32

The wide address bus width of 32 bits allows for efficient data transfer and processing, enhancing overall system performance.

Surface Mount: YES

Surface mount technology enables easy and secure installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Data Transfer Rate: 132 MBps

The high data transfer rate of 132 MBps ensures swift communication between components, improving system responsiveness.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for dense packaging of components, optimizing PCB layout and reducing overall footprint.

Maximum Clock Frequency: 33 MHz

The maximum clock frequency of 33 MHz provides efficient operation and data processing speed, making the product suitable for high-performance applications.

Technical Specifications

Bus Controllers PCI6515AZGK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

132 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B257

Length:

16 mm

No. of Terminals:

257

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI6515AZGK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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