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PCI6421GHK

Texas Instruments

PCI6421GHK by Texas Instruments

PCI6421GHK by Texas Instruments is a bus controller with 32-bit address and external data bus width. It operates at 48 MHz clock frequency, supporting PCI bus compatibility. This low-profile, fine-pitch device has a max data transfer rate of 132 MBps, making it ideal for PCMCIA applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,229 parts In-Stock

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9,229

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Digiode

USA . 3,375 parts In-Stock

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3,375

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$8.392

100+ parts

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559

$8.392

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Parana Technologies

USA . 79 parts In-Stock

1+ parts

$34.290

100+ parts

-

1k+ parts

$146.323

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79

$34.290

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$146.323

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One Stop Electronics

USA . 322 parts In-Stock

1+ parts

$35.000

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322

$35.000

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DigiPath Technology Company

USA . 985 parts In-Stock

1+ parts

$37.757

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985

$37.757

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ChromeModa Solutions

Germany . 4,942 parts In-Stock

1+ parts

$38.528

100+ parts

$31.593

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4,942

$38.528

$31.593

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IDEA Electronic Components Group

UK . 2,084 parts In-Stock

1+ parts

$38.528

100+ parts

$36.602

1k+ parts

$34.675

10k+ parts

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2,084

$38.528

$36.602

$34.675

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Corohmni

South Africa . 260 parts In-Stock

1+ parts

$57.681

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260

$57.681

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Corphita

USA . 4,465 parts In-Stock

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4,465

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Overview

Experience seamless connectivity with the Texas Instruments PCI6421GHK Bus Controller, a high-quality product designed for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust in the reliability and performance of this device. Offering fast data transfer rates and compatibility with PCI buses, this controller ensures efficient operation for your devices. Don't compromise on quality - choose Texas Instruments for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that can withstand various environmental conditions.

Surface Mount: YES

Easy to integrate onto circuit boards, reducing assembly time and costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply voltages for flexibility in system design.

Address Bus Width: 32

Allows for efficient data transfer and communication between components.

Maximum Data Transfer Rate: 132 MBps

High data transfer rate enables fast communication within the system.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high performance.

Bus Compatibility: PCI

Compatible with PCI bus systems for seamless integration into existing setups.

Technical Specifications

Bus Controllers PCI6421GHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

132 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B288

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

288

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI6421GHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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