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PCI6611ZHK

Texas Instruments

PCI6611ZHK by Texas Instruments

PCI6611ZHK by Texas Instruments is a 32-bit bus controller with 132 MBps data transfer rate, suitable for PCI bus compatibility. Operating at 0-70 °C, it has a max clock frequency of 48 MHz and supports external data bus width of 32 bits. The package style is grid array with low profile and fine pitch, featuring a total of 288 terminals in a square shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,858 parts In-Stock

1+ parts

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4,858

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Digiode

USA . 4,489 parts In-Stock

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4,489

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Zilex Electronics Inc.

Canada . 70 parts In-Stock

1+ parts

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70

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,074 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,074

$8.000

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AZTECH Wire

Italy . 196 parts In-Stock

1+ parts

$8.466

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196

$8.466

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Parana Technologies

USA . 1,819 parts In-Stock

1+ parts

$42.307

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1,819

$42.307

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ChromeModa Solutions

Germany . 3,067 parts In-Stock

1+ parts

$47.536

100+ parts

$38.980

1k+ parts

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3,067

$47.536

$38.980

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IDEA Electronic Components Group

UK . 2,009 parts In-Stock

1+ parts

$47.536

100+ parts

$45.159

1k+ parts

$42.782

10k+ parts

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2,009

$47.536

$45.159

$42.782

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Corohmni

South Africa . 536 parts In-Stock

1+ parts

$64.479

100+ parts

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536

$64.479

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Corphita

USA . 4,076 parts In-Stock

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4,076

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DigiPath Technology Company

USA . 1,109 parts In-Stock

1+ parts

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100+ parts

$42.858

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1,109

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$42.858

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Overview

Unlock seamless data transfer and enhanced performance with the Texas Instruments PCI6611ZHK Bus Controller. Crafted with precision and quality by Texas Instruments, this innovative product offers a wide range of applications for various devices. Experience the value and benefits of faster data transfer rates of up to 132 MBps, combined with a maximum clock frequency of 48 MHz. Upgrade your system today with the PCI6611ZHK and enjoy the reliability and efficiency that Texas Instruments products are known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the bus controller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a stable power input for the bus controller, preventing damage due to overvoltage.

Address Bus Width: 32

Provides a wide address bus width for efficient data transmission and processing capabilities.

Package Shape: SQUARE

Compact square shape enables efficient use of space on the PCB.

Power Supplies (V): 1.8,3.3,3.3/5

Offers a variety of power supply options for compatibility with different systems and configurations.

No. of Terminals: 288

Large number of terminals allow for versatile connectivity and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

These package styles make the bus controller suitable for compact and high-density applications.

Minimum Supply Voltage: 3 V

Ensures reliable operation even with lower supply voltages, enhancing flexibility in power requirements.

Maximum Operating Temperature: 70 °C

Can perform under high temperatures without overheating, ensuring continuous operation in various environments.

Maximum Data Transfer Rate: 132 MBps

High data transfer rate enables quick and efficient communication within the system.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and corrosion-resistant finish for the terminals, ensuring stable connections over time.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and soldering during assembly.

Maximum Seated Height: 1.4 mm

Low profile design minimizes the height of the bus controller, making it suitable for slim devices.

Width: 16 mm

Compact width accommodates space constraints on the PCB, allowing for efficient layout designs.

External Data Bus Width: 32

Matches the address bus width for seamless data transfer and processing capabilities.

Maximum Clock Frequency: 48 MHz

High clock frequency supports fast data processing and communication speeds.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specific duration during manufacturing processes.

Peak Reflow Temperature °C: 260

Designed to endure peak reflow temperatures during soldering without compromising performance.

Length: 16 mm

Compact length contributes to space-saving and efficient PCB layout designs.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where standard operating temperatures are expected.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

Specifically designed as a bus controller for PCMCIA interfaces, ensuring compatibility and seamless integration.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed processing capabilities.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and reliability in the connection between the bus controller and the PCB.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for consistent and stable operation of the bus controller.

Bus Compatibility: PCI

Designed to work seamlessly with PCI bus systems, ensuring compatibility and efficient data transfer.

Terminal Pitch: 0.8 mm

Close terminal pitch allows for high-density mounting and compact PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the level of protection against moisture during storage and handling, ensuring product integrity.

Technical Specifications

Bus Controllers PCI6611ZHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

132 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

288

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI6611ZHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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