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PCI6515ZHK

Texas Instruments

PCI6515ZHK by Texas Instruments

PCI6515ZHK by Texas Instruments is a Bus Controller with 32-bit Address Bus Width and 132 MBps Data Transfer Rate. It operates at 3-3.6 V, has a max clock frequency of 33.33 MHz, and is suitable for PCI bus compatibility applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,306 parts In-Stock

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Digiode

USA . 1,455 parts In-Stock

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1,455

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Distributors (Availability)

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AZTECH Wire

Italy . 459 parts In-Stock

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$12.296

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459

$12.296

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Parana Technologies

USA . 873 parts In-Stock

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$15.613

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$15.982

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873

$15.613

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DigiPath Technology Company

USA . 562 parts In-Stock

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$17.192

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$15.817

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562

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IDEA Electronic Components Group

UK . 2,118 parts In-Stock

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$17.543

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$16.666

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$15.789

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2,118

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$16.666

$15.789

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ChromeModa Solutions

Germany . 288 parts In-Stock

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$17.543

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$14.385

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288

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$14.385

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One Stop Electronics

USA . 865 parts In-Stock

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$22.000

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865

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Corohmni

South Africa . 89 parts In-Stock

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$48.584

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A-Z Elektronik GmbH

Germany . 7,175 parts In-Stock

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Corphita

USA . 1,099 parts In-Stock

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Kepictronics

USA . 111 parts In-Stock

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Overview

Experience seamless and efficient data transfer with the Texas Instruments PCI6515ZHK bus controller. Manufactured by a trusted name in the industry, this product offers unparalleled quality and reliability. Ideal for various applications, this device provides a smooth integration into your system, delivering high-speed performance and versatility. Upgrade your setup with the PCI6515ZHK and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for use in portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can safely operate within a wide range of voltage inputs, providing flexibility in power requirements.

Address Bus Width: 32

Wide bus width allows for efficient data transfer and processing capabilities.

Package Shape: SQUARE

Square shape allows for compact placement on circuit boards, saving space and optimizing layout.

Power Supplies (V): 3.3,3.3/5

Supports multiple power supply options, giving users versatility in power configurations.

No. of Terminals: 257

High number of terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with high terminal density, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications.

Maximum Data Transfer Rate: 132 MBps

High data transfer rate allows for quick and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Operates reliably at low temperatures, ensuring performance in various environmental conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to the circuit board.

Maximum Seated Height: 1.4 mm

Low profile design minimizes the overall height of the product, suitable for thin and compact devices.

Width: 16 mm

Compact width dimension allows for efficient placement on the circuit board, optimizing space usage.

External Data Bus Width: 32

Matches the address bus width for seamless data communication and processing.

Maximum Clock Frequency: 33.33 MHz

High clock frequency enables fast data processing and synchronization with other components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during manufacturing and rework processes.

Length: 16 mm

Compact length dimension allows for efficient placement on the circuit board, optimizing space usage.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications, offering reliable performance in typical operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

Designed specifically for bus control and PCMCIA interface, ensuring compatibility and efficient data management.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminals offer secure and reliable connections to the circuit board, minimizing chances of signal loss or disconnection.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the device.

Bus Compatibility: PCI

Designed for PCI bus systems, ensuring seamless integration and communication with other PCI-compliant devices.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density terminal placement, optimizing space on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand periodic exposure to moderate humidity levels, ensuring long-term reliability.

Technical Specifications

Bus Controllers PCI6515ZHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33.33 MHz

Maximum Data Transfer Rate:

132 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B257

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI6515ZHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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