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TUSB9261IPAPQ1

Texas Instruments

TUSB9261IPAPQ1 by Texas Instruments

TUSB9261IPAPQ1 by Texas Instruments is a BUS CONTROLLER IC with 64 terminals, operating at -40 to 85 °C. It supports ATA bus compatibility and offers data transfer rate up to 375 MBps. Ideal for industrial applications requiring USB connectivity with IEEE standards compliance.

Median Price

$11.025

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,599 parts In-Stock

1+ parts

$10.169

100+ parts

$8.883

1k+ parts

$6.126

10k+ parts

-

1,599

$10.169

$8.883

$6.126

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Mouser Electronics

USA . 56 parts In-Stock

1+ parts

$17.200

100+ parts

$11.540

1k+ parts

$10.950

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56

$17.200

$11.540

$10.950

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Rochester

USA . 14,165 parts In-Stock

1+ parts

-

100+ parts

$8.820

1k+ parts

$7.890

10k+ parts

$7.420

14,165

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$8.820

$7.890

$7.420

DigiKey

USA . 14,165 parts In-Stock

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$11.600

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$11.600

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Verical

USA . 14,042 parts In-Stock

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$11.025

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$9.863

10k+ parts

$9.275

14,042

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$11.025

$9.863

$9.275

Distributors (In-Stock)

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Digiode

USA . 3,212 parts In-Stock

1+ parts

$8.084

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3,212

$8.084

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Nova Conductors

Japan . 48 parts In-Stock

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$9.080

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48

$9.080

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DigiKey Marketplace

USA . 14,192 parts In-Stock

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Vyrian

USA . 7,350 parts In-Stock

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7,350

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Chip Stock

USA . 3,431 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 7,203 parts In-Stock

1+ parts

$7.230

100+ parts

$7.049

1k+ parts

$7.013

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7,203

$7.230

$7.049

$7.013

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Ampacity Inc.

Singapore . 7,185 parts In-Stock

1+ parts

$7.230

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7,185

$7.230

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Corphita

USA . 4,131 parts In-Stock

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$7.659

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$7.659

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Continental Prestige Electronics

USA . 5,894 parts In-Stock

1+ parts

$8.809

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$8.633

5,894

$8.809

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$8.633

Corohmni

South Africa . 286 parts In-Stock

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$26.248

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286

$26.248

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Parana Technologies

USA . 1,326 parts In-Stock

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$42.469

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1,326

$42.469

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ChromeModa Solutions

Germany . 4,440 parts In-Stock

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$47.718

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$39.129

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4,440

$47.718

$39.129

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IDEA Electronic Components Group

UK . 996 parts In-Stock

1+ parts

$47.718

100+ parts

$45.332

1k+ parts

$42.946

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996

$47.718

$45.332

$42.946

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 16,089 parts In-Stock

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DigiPath Technology Company

USA . 1,684 parts In-Stock

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$43.023

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1,684

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Argo Parts USA

USA . 1,649 parts In-Stock

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A-Z Elektronik GmbH

Germany . 160 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$8.898

1k+ parts

$8.626

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$8.444

100

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$8.898

$8.626

$8.444

Advanced Electronics

New Zealand . 46 parts In-Stock

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Overview

Elevate your device connectivity with the TUSB9261IPAPQ1 by Texas Instruments. This high-quality bus controller offers seamless integration and reliability, thanks to Texas Instruments' reputation for excellence in electronic components. Ideal for a wide range of applications, this product provides fast data transfer speeds, robust performance, and industrial-grade durability. Experience the value and benefits of enhanced connectivity with the TUSB9261IPAPQ1 – the perfect solution for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the bus controller, making it a reliable choice for various applications.

Surface Mount: YES

The surface-mount capability allows for easy installation and integration into circuit boards, saving time and effort in the assembly process.

Maximum Supply Voltage: 1.155 V

With a high maximum supply voltage, this bus controller can handle demanding power requirements, ensuring stable performance.

Screening Level: AEC-Q100

This screening level ensures that the bus controller meets automotive industry standards for quality and reliability, making it suitable for vehicle applications.

Package Shape: SQUARE

The square shape of the package provides a compact design, allowing for efficient use of space on the circuit board.

No. of Terminals: 64

With a high number of terminals, this bus controller can accommodate multiple connections, making it versatile for various interface requirements.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The diverse package styles offer flexibility in mounting options and cooling solutions, catering to different design needs.

Minimum Supply Voltage: 1.045 V

The low minimum supply voltage helps in reducing power consumption and heat generation, promoting energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Maximum Data Transfer Rate: 375 MBps

With a high data transfer rate, this bus controller can handle large amounts of data quickly, improving overall system efficiency.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the bus controller to function in cold environments without loss of performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: QUAD

The quad terminal position allows for easy connection to other components, simplifying the installation process.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in maintaining a compact overall design, ideal for space-constrained applications.

Width: 10 mm

The compact width of the bus controller contributes to space-saving on the circuit board, especially in densely populated designs.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency, this bus controller can process data at a fast rate, enhancing system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures that the bus controller is not exposed to excessive heat for extended periods, preventing damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows the bus controller to withstand the heat of the reflow soldering process, ensuring reliable solder joints.

Length: 10 mm

The short length of the bus controller contributes to a compact overall footprint, enabling efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating certifies that the bus controller can operate reliably in harsh industrial environments, ensuring long-term performance.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

This peripheral IC type indicates that the bus controller is designed for USB applications, offering compatibility and ease of integration with USB devices.

Technology: CMOS

The CMOS technology used in the bus controller provides low power consumption and high noise immunity, resulting in efficient and reliable operation.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process and ensures a secure connection, enhancing the overall reliability of the bus controller.

Nominal Supply Voltage: 1.1 V

With a stable nominal supply voltage, this bus controller maintains consistent performance under varying load conditions, ensuring reliability.

Bus Compatibility: ATA

The compatibility with ATA bus standards makes this bus controller suitable for ATA-based storage devices, providing seamless integration into storage systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting, making it suitable for applications with space constraints and fine-pitch requirements.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the bus controller has moderate sensitivity to moisture, requiring standard precautions during handling and storage.

Drive Interface Standard: IEEE 1149.6; IEEE 1149.1

Compliance with IEEE drive interface standards ensures compatibility and interoperability with various devices, making it a versatile choice for different applications.

Technical Specifications

Bus Controllers TUSB9261IPAPQ1 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Bus Compatibility:

ATA

Maximum Clock Frequency:

40 MHz

Maximum Data Transfer Rate:

375 MBps

Drive Interface Standard:

IEEE 1149.6; IEEE 1149.1

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TUSB9261IPAPQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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