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MSP430F6778IPEUR

Texas Instruments

MSP430F6778IPEUR by Texas Instruments

MSP430F6778IPEUR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words, 16384 RAM bytes, and max clock frequency of 25 MHz. Ideal for industrial applications, it operates b/w -40 to 85 °C with a supply voltage range of 1.8-3.6 V. Compatible with I2C, SPI, and UART buses for versatile connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,901 parts In-Stock

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Digiode

USA . 2,438 parts In-Stock

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2,438

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Distributors (Availability)

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AZTECH Wire

Italy . 876 parts In-Stock

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$5.333

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876

$5.333

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Parana Technologies

USA . 692 parts In-Stock

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$31.271

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$76.409

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692

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One Stop Electronics

USA . 496 parts In-Stock

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$32.000

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496

$32.000

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ChromeModa Solutions

Germany . 3,370 parts In-Stock

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$35.136

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$28.812

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$35.136

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IDEA Electronic Components Group

UK . 2,266 parts In-Stock

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$35.136

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$33.379

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$31.622

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2,266

$35.136

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$31.622

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Corohmni

South Africa . 2,745 parts In-Stock

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$68.680

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Corphita

USA . 2,790 parts In-Stock

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DigiPath Technology Company

USA . 1,967 parts In-Stock

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$31.679

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Microchip USA

USA . 400 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the Texas Instruments MSP430F6778IPEUR. As a leader in semiconductor manufacturing, Texas Instruments delivers cutting-edge technology in the form of this versatile microprocessor circuit. Ideal for a wide range of applications, this product offers customers exceptional value and benefits. From its low power consumption to its high clock frequency, the MSP430F6778IPEUR is designed to meet your industrial needs with ease. Upgrade your projects today with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for greater flexibility in powering the device and handling various voltage requirements.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities for more complex applications and tasks.

Power Supplies (V): 2/3.3

Supports multiple power supply options, making it versatile and compatible with different power sources.

No. of Terminals: 128

With 128 terminals, this IC offers ample connectivity options for interfacing with other components or peripherals.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications where heat resistance is crucial.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption and high performance, ideal for energy-efficient devices.

ROM Words: 524288

Extensive ROM capacity enables storing a large amount of data or program code, essential for advanced functionalities.

RAM Bytes: 16384

Sufficient RAM size for efficient data processing and manipulation, ensuring smooth operation of the device.

Technology: CMOS

CMOS technology offers low power consumption, reducing energy usage and extending battery life in portable devices.

ROM Programmability: FLASH

Flash ROM allows for reprogramming and updating firmware easily, facilitating flexibility and adaptability in the device.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6778IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6778IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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