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MSP430F67781AIPZ

Texas Instruments

MSP430F67781AIPZ by Texas Instruments

MSP430F67781AIPZ by Texas Instruments is a 16-bit microprocessor with 6-Ch 10-Bit ADC channels and 62 I/O lines. It operates at a max clock frequency of 0.032768 MHz, suitable for industrial applications requiring low power consumption and high performance. The package style is flatpack, low profile, fine pitch, making it ideal for compact designs in temperature-sensitive environments.

Median Price

$12.072

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 739 parts In-Stock

1+ parts

$12.072

100+ parts

$10.544

1k+ parts

$7.272

10k+ parts

-

739

$12.072

$10.544

$7.272

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,583 parts In-Stock

1+ parts

$11.468

100+ parts

-

1k+ parts

-

10k+ parts

-

3,583

$11.468

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-

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Vyrian

USA . 7,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,382

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,876 parts In-Stock

1+ parts

$10.865

100+ parts

-

1k+ parts

-

10k+ parts

-

4,876

$10.865

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-

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AZTECH Wire

Italy . 678 parts In-Stock

1+ parts

$11.810

100+ parts

-

1k+ parts

-

10k+ parts

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678

$11.810

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Microchip USA

USA . 2,880 parts In-Stock

1+ parts

$33.520

100+ parts

$33.040

1k+ parts

$32.800

10k+ parts

$32.560

2,880

$33.520

$33.040

$32.800

$32.560

Corohmni

South Africa . 35 parts In-Stock

1+ parts

$42.522

100+ parts

-

1k+ parts

-

10k+ parts

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35

$42.522

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-

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Parana Technologies

USA . 1,136 parts In-Stock

1+ parts

$60.272

100+ parts

-

1k+ parts

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10k+ parts

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1,136

$60.272

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ChromeModa Solutions

Germany . 4,287 parts In-Stock

1+ parts

$67.721

100+ parts

$55.531

1k+ parts

-

10k+ parts

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4,287

$67.721

$55.531

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IDEA Electronic Components Group

UK . 2,070 parts In-Stock

1+ parts

$67.721

100+ parts

$64.335

1k+ parts

$60.949

10k+ parts

-

2,070

$67.721

$64.335

$60.949

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DigiPath Technology Company

USA . 904 parts In-Stock

1+ parts

-

100+ parts

$61.057

1k+ parts

-

10k+ parts

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904

-

$61.057

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Overview

Unlock the full potential of your electronic designs with the Texas Instruments MSP430F67781AIPZ. As a leader in semiconductor manufacturing, Texas Instruments delivers top-quality products that are reliable and efficient. This versatile microprocessor circuit offers a wide range of applications, from industrial automation to consumer electronics. With its advanced features like multiple ADC and DMA channels, low power consumption, and high clock frequency, this MSP430F67781AIPZ provides exceptional value and performance for all your project needs. Upgrade your designs today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications and power sources.

Package Shape: SQUARE

Optimizes space utilization on the circuit board.

Bit Size: 16

Provides sufficient processing power for various tasks and calculations.

No. of Terminals: 100

Offers ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances thermal performance and allows for compact designs.

Minimum Supply Voltage: 2.4 V

Suitable for low-power applications, optimizing energy efficiency.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables the IC to perform a variety of functions and tasks efficiently.

Maximum Clock Frequency: 0.032768 MHz

Provides fast processing speeds for quick response times.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Supports multiple communication protocols, increasing compatibility with other devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67781AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67781AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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