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MSP430F67781AIPEUR

Texas Instruments

MSP430F67781AIPEUR by Texas Instruments

MSP430F67781AIPEUR by Texas Instruments is a 16-bit MCU with 524288 ROM words, 6-Ch 10-Bit ADC channels, and 3 DMA channels. Ideal for industrial applications due to -40 to 85 °C operating temp range, featuring BOR, RTC, and SPI connectivity.

Median Price

$9.869

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,253 parts In-Stock

1+ parts

$9.869

100+ parts

$8.620

1k+ parts

$5.945

10k+ parts

-

1,253

$9.869

$8.620

$5.945

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,844 parts In-Stock

1+ parts

$9.376

100+ parts

-

1k+ parts

-

10k+ parts

-

3,844

$9.376

-

-

-

Vyrian

USA . 2,314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,314

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 897 parts In-Stock

1+ parts

$8.882

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$8.882

-

-

-

AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$8.970

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$8.970

-

-

-

Corohmni

South Africa . 1 parts In-Stock

1+ parts

$19.626

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$19.626

-

-

-

Parana Technologies

USA . 2,017 parts In-Stock

1+ parts

$57.232

100+ parts

-

1k+ parts

-

10k+ parts

-

2,017

$57.232

-

-

-

DigiPath Technology Company

USA . 1,864 parts In-Stock

1+ parts

$63.020

100+ parts

-

1k+ parts

-

10k+ parts

-

1,864

$63.020

-

-

-

IDEA Electronic Components Group

UK . 825 parts In-Stock

1+ parts

$64.306

100+ parts

$61.091

1k+ parts

$57.875

10k+ parts

-

825

$64.306

$61.091

$57.875

-

ChromeModa Solutions

Germany . 312 parts In-Stock

1+ parts

$64.306

100+ parts

$52.731

1k+ parts

-

10k+ parts

-

312

$64.306

$52.731

-

-

Overview

Unlock endless possibilities with the MSP430F67781AIPEUR by Texas Instruments, a cutting-edge microprocessor circuit that offers exceptional quality and performance. This versatile device is ideal for a wide range of applications, from IoT devices to industrial automation. With advanced features like multiple ADC and DMA channels, along with various connectivity options, this product provides unparalleled value and efficiency. Trust in Texas Instruments' reputation for excellence and innovation, and elevate your projects to new heights with the MSP430F67781AIPEUR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can support the efficient operation of the product without risking damage.

Bit Size: 16

With a larger bit size, the product can handle more complex calculations and functions, enhancing its performance capabilities.

ADC Channels: YES

The presence of analog to digital converters allows the product to easily interface with analog signals, expanding its range of applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring consistent performance in challenging conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities for handling complex tasks efficiently.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67781AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67781AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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