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MSP430F6777AIPEU

Texas Instruments

MSP430F6777AIPEU by Texas Instruments

MSP430F6777AIPEU by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and WDT. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$9.925

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,978 parts In-Stock

1+ parts

$9.925

100+ parts

$8.091

1k+ parts

$5.394

10k+ parts

-

1,978

$9.925

$8.091

$5.394

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,012 parts In-Stock

1+ parts

$9.429

100+ parts

-

1k+ parts

-

10k+ parts

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1,012

$9.429

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Chip Stock

USA . 9,100 parts In-Stock

1+ parts

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100+ parts

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9,100

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Vyrian

USA . 5,072 parts In-Stock

1+ parts

-

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5,072

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 144 parts In-Stock

1+ parts

$8.932

100+ parts

-

1k+ parts

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144

$8.932

-

-

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AZTECH Wire

Italy . 698 parts In-Stock

1+ parts

$9.420

100+ parts

-

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698

$9.420

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Corohmni

South Africa . 2,566 parts In-Stock

1+ parts

$25.488

100+ parts

-

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2,566

$25.488

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Parana Technologies

USA . 1,845 parts In-Stock

1+ parts

$35.573

100+ parts

-

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1,845

$35.573

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ChromeModa Solutions

Germany . 3,633 parts In-Stock

1+ parts

$39.970

100+ parts

$32.775

1k+ parts

-

10k+ parts

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3,633

$39.970

$32.775

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IDEA Electronic Components Group

UK . 2,215 parts In-Stock

1+ parts

$39.970

100+ parts

$37.972

1k+ parts

$35.973

10k+ parts

-

2,215

$39.970

$37.972

$35.973

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DigiPath Technology Company

USA . 1,633 parts In-Stock

1+ parts

-

100+ parts

$36.037

1k+ parts

-

10k+ parts

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1,633

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$36.037

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Overview

Elevate your projects with the high-quality MSP430F6777AIPEU by Texas Instruments, a top-tier manufacturer renowned for cutting-edge technology. This versatile microprocessor circuit offers unparalleled value with its wide range of applications in various industries. From industrial automation to consumer electronics, this product delivers exceptional performance, reliability, and efficiency. Maximize your design possibilities and stay ahead of the competition with the MSP430F6777AIPEU.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and cost-effective, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact and space-saving design, making it suitable for small electronic devices.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for increased flexibility in power supply requirements.

Bit Size: 16

16-bit architecture provides higher precision and performance compared to lower bit sizes.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack design with low profile and fine pitch terminals enhances thermal performance and allows for high-density mounting.

ADC Channels: YES

Built-in Analog to Digital Converters provide the ability to interface with analog sensors or signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU for other tasks.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data and instructions.

RAM Words: 32

Although limited, the RAM capacity provides temporary storage for variables and data during program execution.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product combines processing and peripheral functions in a single integrated package.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6777AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6777AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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