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MSP430F67771IPEUR

Texas Instruments

MSP430F67771IPEUR by Texas Instruments

MSP430F67771IPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. Operating at -40 to 85 °C, it has a max supply voltage of 3.6 V and supports I2C, SPI, UART bus compatibility. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$11.130

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 67,385 parts In-Stock

1+ parts

$11.130

100+ parts

$9.074

1k+ parts

$6.049

10k+ parts

-

67,385

$11.130

$9.074

$6.049

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,376 parts In-Stock

1+ parts

$10.574

100+ parts

-

1k+ parts

-

10k+ parts

-

2,376

$10.574

-

-

-

Vyrian

USA . 4,374 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,374

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,778 parts In-Stock

1+ parts

$10.017

100+ parts

-

1k+ parts

-

10k+ parts

-

4,778

$10.017

-

-

-

AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$11.900

100+ parts

-

1k+ parts

-

10k+ parts

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329

$11.900

-

-

-

Corohmni

South Africa . 899 parts In-Stock

1+ parts

$12.384

100+ parts

-

1k+ parts

-

10k+ parts

-

899

$12.384

-

-

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Parana Technologies

USA . 883 parts In-Stock

1+ parts

$60.014

100+ parts

-

1k+ parts

-

10k+ parts

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883

$60.014

-

-

-

DigiPath Technology Company

USA . 2,304 parts In-Stock

1+ parts

$66.082

100+ parts

$60.796

1k+ parts

-

10k+ parts

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2,304

$66.082

$60.796

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-

IDEA Electronic Components Group

UK . 811 parts In-Stock

1+ parts

$67.431

100+ parts

$64.059

1k+ parts

$60.688

10k+ parts

-

811

$67.431

$64.059

$60.688

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ChromeModa Solutions

Germany . 683 parts In-Stock

1+ parts

$67.431

100+ parts

$55.293

1k+ parts

-

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683

$67.431

$55.293

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Perfect Parts

USA . 45,360 parts In-Stock

1+ parts

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100+ parts

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45,360

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F67771IPEUR microprocessor circuit. Designed with cutting-edge CMOS technology, this versatile IC offers unmatched performance and reliability for a wide range of applications. From IoT devices to industrial automation, the MSP430F67771IPEUR delivers high-speed processing, low power consumption, and seamless integration with I2C, SPI, and UART buses. Trust in Texas Instruments' reputation for quality and experience a new level of efficiency in your projects. Elevate your designs with the MSP430F67771IPEUR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and reliability, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more efficient and compact PCB design, saving space and improving overall system performance.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making the product versatile for different applications.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to integrate into existing PCB designs, simplifying the product implementation process.

Bit Size: 16

A 16-bit architecture provides enhanced processing capabilities, allowing for efficient data manipulation and computation.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for compatibility with a wide range of power sources, increasing the product's flexibility.

No. of Terminals: 128

Having a high number of terminals enables the product to connect to a variety of external components, enhancing its functionality and usability.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style offers space-saving benefits and allows for efficient heat dissipation, improving overall system performance.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement allows for operation in low-power scenarios, making the product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, increasing its reliability and longevity.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures compatibility with a range of peripherals and support tools, making it easier for developers to work with the product.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the product to function effectively in extreme cold environments, expanding its potential applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers superior conductivity and corrosion resistance, ensuring reliable connections and optimal signal transmission.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, enhancing the product's ability to interface with external sensors and devices.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, reducing the risk of signal interference or disconnection in demanding operating conditions.

ROM Words: 262144

The large ROM storage capacity enables the product to store a significant amount of program data, supporting complex applications and multitasking capabilities.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures compatibility with slim and compact designs, making the product suitable for space-constrained applications.

RAM Words: 32

Although limited, the RAM storage capacity is sufficient for handling data processing tasks efficiently, contributing to the overall performance of the product.

Width: 14 mm

The compact width of the product allows for easy integration into tight spaces, enabling design flexibility and versatility in various application scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures proper soldering and assembly of the product, facilitating reliable and durable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the soldering process without damage, ensuring manufacturing efficiency and product reliability.

Length: 20 mm

The moderate length of the product allows for easy placement on PCBs and integration into various enclosure designs, enhancing the overall system aesthetics and functionality.

Temperature Grade: INDUSTRIAL

Designed for use in industrial environments, the product can withstand harsh conditions and operate reliably in demanding applications, making it a robust choice for industrial settings.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced processing capabilities and versatile interfacing options, making it suitable for a wide range of applications requiring complex data processing tasks.

RAM Bytes: 32768

With a large RAM storage capacity in bytes, the product can efficiently handle data processing and storage requirements, supporting high-performance computing tasks and multitasking operations.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making the product energy-efficient and suitable for battery-powered applications requiring fast data processing.

Terminal Form: GULL WING

The gull wing terminal form offers reliable solder connections and easy visual inspection during assembly, ensuring proper installation and consistent performance of the product.

Maximum Supply Current: 11.75 mA

The low maximum supply current consumption makes the product energy-efficient and suitable for battery-powered devices, extending the runtime and overall battery life.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent performance and reliable operation of the product, supporting continuous data processing and system functionality.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast updates to the product's firmware or software, enabling customization and adaptation to changing application requirements.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus interfaces, including I2C, SPI, and UART, enables the product to communicate with a variety of external devices and peripherals, expanding its connectivity and compatibility options.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm offers precise and secure connections, minimizing signal interference and ensuring reliable data transmission in high-speed applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture exposure during storage or handling, requiring standard precautions to prevent potential damage to the product.

Speed: 25 rpm

With a speed rating of 25 rpm, the product can efficiently process data and perform calculations at a high speed, supporting real-time computing tasks and time-sensitive operations.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67771IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67771IPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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