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MSP430F6776IPEU

Texas Instruments

MSP430F6776IPEU by Texas Instruments

MSP430F6776IPEU by Texas Instruments is a 16-bit MCU with 262144 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it supports I2C, SPI, UART buses for industrial applications requiring low power consumption and high clock frequency. The package style is flatpack with a low profile, making it suitable for compact designs.

Median Price

$10.122

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$10.122

100+ parts

$8.252

1k+ parts

$5.501

10k+ parts

-

758

$10.122

$8.252

$5.501

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,311 parts In-Stock

1+ parts

$9.616

100+ parts

-

1k+ parts

-

10k+ parts

-

1,311

$9.616

-

-

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Vyrian

USA . 6,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,615

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 44 parts In-Stock

1+ parts

$8.857

100+ parts

-

1k+ parts

-

10k+ parts

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44

$8.857

-

-

-

Corphita

USA . 2,358 parts In-Stock

1+ parts

$9.110

100+ parts

-

1k+ parts

-

10k+ parts

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2,358

$9.110

-

-

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AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$16.310

100+ parts

-

1k+ parts

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10k+ parts

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587

$16.310

-

-

-

Advanced Electronics

New Zealand . 32 parts In-Stock

1+ parts

$16.428

100+ parts

$14.949

1k+ parts

$13.471

10k+ parts

-

32

$16.428

$14.949

$13.471

-

Microchip USA

USA . 2,209 parts In-Stock

1+ parts

$28.780

100+ parts

$28.370

1k+ parts

$28.160

10k+ parts

$27.960

2,209

$28.780

$28.370

$28.160

$27.960

Parana Technologies

USA . 862 parts In-Stock

1+ parts

$64.844

100+ parts

-

1k+ parts

-

10k+ parts

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862

$64.844

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-

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DigiPath Technology Company

USA . 844 parts In-Stock

1+ parts

$71.401

100+ parts

-

1k+ parts

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10k+ parts

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844

$71.401

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ChromeModa Solutions

Germany . 2,862 parts In-Stock

1+ parts

$72.858

100+ parts

$59.744

1k+ parts

-

10k+ parts

-

2,862

$72.858

$59.744

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IDEA Electronic Components Group

UK . 1,386 parts In-Stock

1+ parts

$72.858

100+ parts

$69.215

1k+ parts

$65.572

10k+ parts

-

1,386

$72.858

$69.215

$65.572

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F6776IPEU. This high-quality microprocessor circuit offers unparalleled performance in a compact package, making it ideal for a wide range of applications. With a maximum clock frequency of 25 MHz and a flash ROM programmability, this device provides seamless integration and efficient operation. Trust in Texas Instruments' reputation for excellence and innovation, and experience the difference that the MSP430F6776IPEU can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards and saves space.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with various power sources.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient placement and layout on PCBs.

Bit Size: 16

16-bit processing capability provides sufficient computing power for various applications.

Power Supplies (V): 2/3.3

The availability of multiple power supply options provides flexibility in design and usage.

No. of Terminals: 128

Having 128 terminals allows for the connection of multiple input and output devices.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and space-saving design for high-density PCB layouts.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for operation in low-power environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and efficient performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish ensures good conductivity and corrosion resistance.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, making the product versatile.

Terminal Position: QUAD

Quad terminal position ensures stable and secure connections on PCBs.

ROM Words: 262144

The large ROM size allows for storing a significant amount of program data.

Maximum Seated Height: 1.6 mm

Low seated height enables slim and compact device designs.

RAM Words: 16

The RAM size of 16 words provides temporary storage for efficient data processing.

Width: 14 mm

The compact width makes the product suitable for use in space-constrained applications.

Maximum Clock Frequency: 25 MHz

The high clock frequency of 25 MHz enables fast data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and component bonding.

Length: 20 mm

The compact length of 20 mm facilitates space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product can handle complex tasks efficiently.

RAM Bytes: 16384

The large RAM size of 16,384 bytes provides ample data storage for processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form ensures secure and reliable solder connections.

Maximum Supply Current: 11.75 mA

The low maximum supply current helps in reducing power consumption.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable operation for the product.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the program data.

Bus Compatibility: I2C; SPI; UART

Compatibility with I2C, SPI, and UART interfaces enables seamless communication with other devices.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand standard moisture exposure during handling and storage.

Speed: 25 rpm

The speed of 25 rpm indicates the maximum processing speed of the product in rotations per minute.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6776IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6776IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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