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MSP430F6776AIPEUR

Texas Instruments

MSP430F6776AIPEUR by Texas Instruments

MSP430F6776AIPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.169

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,450 parts In-Stock

1+ parts

$7.169

100+ parts

$5.844

1k+ parts

$3.896

10k+ parts

-

1,450

$7.169

$5.844

$3.896

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,625 parts In-Stock

1+ parts

$6.811

100+ parts

-

1k+ parts

-

10k+ parts

-

1,625

$6.811

-

-

-

Vyrian

USA . 2,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,784

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 135 parts In-Stock

1+ parts

$6.452

100+ parts

-

1k+ parts

-

10k+ parts

-

135

$6.452

-

-

-

Microchip USA

USA . 2,111 parts In-Stock

1+ parts

$17.080

100+ parts

$16.830

1k+ parts

$16.710

10k+ parts

$16.590

2,111

$17.080

$16.830

$16.710

$16.590

AZTECH Wire

Italy . 849 parts In-Stock

1+ parts

$18.960

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$18.960

-

-

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Corohmni

South Africa . 5,143 parts In-Stock

1+ parts

$60.597

100+ parts

-

1k+ parts

-

10k+ parts

-

5,143

$60.597

-

-

-

Parana Technologies

USA . 348 parts In-Stock

1+ parts

$72.921

100+ parts

$6,771.845

1k+ parts

$65.629

10k+ parts

-

348

$72.921

$6,771.845

$65.629

-

DigiPath Technology Company

USA . 199 parts In-Stock

1+ parts

$80.295

100+ parts

$73.872

1k+ parts

-

10k+ parts

-

199

$80.295

$73.872

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-

ChromeModa Solutions

Germany . 2,874 parts In-Stock

1+ parts

$81.934

100+ parts

$67.186

1k+ parts

-

10k+ parts

-

2,874

$81.934

$67.186

-

-

IDEA Electronic Components Group

UK . 2,239 parts In-Stock

1+ parts

$81.934

100+ parts

$77.837

1k+ parts

$73.741

10k+ parts

-

2,239

$81.934

$77.837

$73.741

-

Overview

Unleash the power of innovation with the MSP430F6776AIPEUR by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers exceptional performance in the realm of Other Function uPs,uCs & Peripheral ICs. This versatile microprocessor circuit offers a wide range of applications, including BOR, COMPARATOR, DMA, RTC, TIMER, and WDT peripherals. With features like 16-bit processing, 128 terminals, and 262144 ROM words, this industrial-grade gem boasts a minimum operating temperature of -40°C and a maximum clock frequency of 0.032768 MHz. Elevate your projects to new heights with the MSP430F6776AIPEUR, where value meets reliability, and innovation knows no bounds.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy integration onto circuit boards and saves space in electronic devices.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage requirements, offering flexibility in power supply options.

Bit Size: 16

Provides a good balance between processing power and efficiency for various applications.

ADC Channels: YES

Allows for accurate analog to digital conversion, essential for many sensor-based applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes various peripheral functions such as timers, UART, and SPI, enhancing the capabilities of the product.

Maximum Clock Frequency: 0.032768 MHz

Offers efficient processing speed for real-time applications while consuming less power.

ROM Programmability: FLASH

Enables programming and reprogramming of the memory, allowing for flexibility in firmware updates.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Provides multiple communication options, making it versatile for various connectivity requirements.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6776AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI;UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6776AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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