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MSP430F6775IPEUR

Texas Instruments

MSP430F6775IPEUR by Texas Instruments

MSP430F6775IPEUR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words, 16384 RAM bytes, and max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high performance in a compact package. Compatible with I2C, SPI, and UART bus interfaces for versatile connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,476 parts In-Stock

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3,476

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Vyrian

USA . 2,868 parts In-Stock

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2,868

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 812 parts In-Stock

1+ parts

$17.696

100+ parts

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812

$17.696

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Parana Technologies

USA . 1,204 parts In-Stock

1+ parts

$22.883

100+ parts

-

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$23.545

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1,204

$22.883

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$23.545

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DigiPath Technology Company

USA . 2,355 parts In-Stock

1+ parts

$25.197

100+ parts

$23.181

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2,355

$25.197

$23.181

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ChromeModa Solutions

Germany . 2,562 parts In-Stock

1+ parts

$25.711

100+ parts

$21.083

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2,562

$25.711

$21.083

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IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$25.711

100+ parts

$24.425

1k+ parts

$23.140

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1,206

$25.711

$24.425

$23.140

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One Stop Electronics

USA . 461 parts In-Stock

1+ parts

$33.000

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461

$33.000

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Corohmni

South Africa . 59 parts In-Stock

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$43.963

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59

$43.963

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Corphita

USA . 4,100 parts In-Stock

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Microchip USA

USA . 263 parts In-Stock

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Overview

Unlock innovative solutions with the MSP430F6775IPEUR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. This product falls within the category of Other Function uPs, uCs & Peripheral ICs, offering a wide range of applications. Experience the value this product brings with its advanced features, high performance, and efficient power consumption. Trust Texas Instruments to provide cutting-edge technology that enhances your projects and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside the package.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and saves space on the board.

Maximum Supply Voltage: 3.6 V

Supports a relatively high supply voltage, making it versatile for different power requirements.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into different PCB layouts.

Bit Size: 16

16-bit processing capability allows for handling of complex operations efficiently.

Power Supplies (V): 2/3.3

Supports multiple power supply options, providing flexibility in design.

No. of Terminals: 128

Sufficient terminals for connecting to other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact package style with low profile and fine pitch for space-saving and efficient PCB design.

Minimum Supply Voltage: 1.8 V

Can operate at a low supply voltage, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications.

CPU Family: MSP430

Part of the MSP430 family known for low-power consumption and high performance.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures, suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connections and long-term performance.

Terminal Position: QUAD

Quad terminal position for stable mounting on the PCB.

ROM Words: 131072

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and space-saving integration.

Width: 14 mm

Compact width for efficient PCB layout and space utilization.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring reliability during assembly.

Peak Reflow Temperature °C: 260

Can withstand high peak reflow temperatures during the assembly process.

Length: 20 mm

Compact length for efficient PCB layout and space utilization.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates a microprocessor circuit for versatile functionality and processing capabilities.

RAM Bytes: 16384

Sufficient RAM capacity for temporary data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections on the PCB.

Maximum Supply Current: 11.75 mA

Low supply current consumption for energy efficiency.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

ROM Programmability: FLASH

ROM programmable using flash technology for easy updating and customization.

Bus Compatibility: I2C; SPI; UART

Supports multiple bus protocols for versatile communication with other components.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise and compact PCB integration.

Moisture Sensitivity Level (MSL): 3

MSL 3 level indicates moderate sensitivity to moisture, suitable for standard manufacturing processes.

Speed: 25 rpm

Operates at a speed of 25 rpm for efficient processing and response times.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6775IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6775IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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