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MSP430F6775AIPZ

Texas Instruments

MSP430F6775AIPZ by Texas Instruments

MSP430F6775AIPZ by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.684

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 900 parts In-Stock

1+ parts

$7.684

100+ parts

$6.264

1k+ parts

$4.176

10k+ parts

-

900

$7.684

$6.264

$4.176

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,854 parts In-Stock

1+ parts

$7.300

100+ parts

-

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3,854

$7.300

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Vyrian

USA . 7,077 parts In-Stock

1+ parts

-

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7,077

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Chip Stock

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 485 parts In-Stock

1+ parts

$6.916

100+ parts

-

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485

$6.916

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AZTECH Wire

Italy . 1,165 parts In-Stock

1+ parts

$12.590

100+ parts

-

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1,165

$12.590

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Microchip USA

USA . 2,668 parts In-Stock

1+ parts

$21.020

100+ parts

$20.720

1k+ parts

$20.570

10k+ parts

$20.420

2,668

$21.020

$20.720

$20.570

$20.420

Parana Technologies

USA . 91 parts In-Stock

1+ parts

$57.434

100+ parts

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91

$57.434

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DigiPath Technology Company

USA . 2,304 parts In-Stock

1+ parts

$63.242

100+ parts

$58.183

1k+ parts

-

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2,304

$63.242

$58.183

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ChromeModa Solutions

Germany . 1,759 parts In-Stock

1+ parts

$64.533

100+ parts

$52.917

1k+ parts

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1,759

$64.533

$52.917

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IDEA Electronic Components Group

UK . 1,180 parts In-Stock

1+ parts

$64.533

100+ parts

$61.306

1k+ parts

$58.080

10k+ parts

-

1,180

$64.533

$61.306

$58.080

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Corohmni

South Africa . 213 parts In-Stock

1+ parts

$75.059

100+ parts

-

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213

$75.059

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Overview

Discover the powerful Texas Instruments MSP430F6775AIPZ, a versatile microprocessor circuit that offers unparalleled performance and reliability. With its innovative technology and wide range of peripherals including ADC channels and DMA channels, this product is ideal for various applications in industrial settings. The MSP430F6775AIPZ provides customers with a seamless connectivity experience through I2C, IRDA, SPI, and UART interfaces, making it a top choice for projects requiring precision and efficiency. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations. Unlock your project's full potential with the MSP430F6775AIPZ today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with various power sources, increasing the flexibility of the product.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures efficient power consumption and operation in low voltage environments.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures that the product benefits from a range of features and optimizations specific to this family, enhancing performance.

Analog To Digital Convertors: 6-Ch 10-Bit

Having 6 analog to digital converters with 10-bit resolution each allows for precise and accurate conversion of analog signals, making the product suitable for applications requiring detailed data acquisition.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The multiple connectivity options such as I2C, IRDA, SPI, and UART enable the product to easily communicate with other devices and systems, enhancing its versatility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6775AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6775AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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