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MSP430F67751IPEU

Texas Instruments

MSP430F67751IPEU by Texas Instruments

MSP430F67751IPEU by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it has a max supply voltage of 3.6 V and consumes up to 11.75 mA. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.347

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$7.347

100+ parts

$5.990

1k+ parts

$3.993

10k+ parts

-

758

$7.347

$5.990

$3.993

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,185 parts In-Stock

1+ parts

$6.980

100+ parts

-

1k+ parts

-

10k+ parts

-

4,185

$6.980

-

-

-

Vyrian

USA . 7,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,577

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 680 parts In-Stock

1+ parts

$6.612

100+ parts

-

1k+ parts

-

10k+ parts

-

680

$6.612

-

-

-

Corohmni

South Africa . 5,226 parts In-Stock

1+ parts

$8.128

100+ parts

-

1k+ parts

-

10k+ parts

-

5,226

$8.128

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-

-

AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$18.180

100+ parts

-

1k+ parts

-

10k+ parts

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443

$18.180

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-

-

Microchip USA

USA . 2,002 parts In-Stock

1+ parts

$23.150

100+ parts

$22.820

1k+ parts

$22.650

10k+ parts

$22.490

2,002

$23.150

$22.820

$22.650

$22.490

Parana Technologies

USA . 1,419 parts In-Stock

1+ parts

$27.125

100+ parts

-

1k+ parts

$32.520

10k+ parts

-

1,419

$27.125

-

$32.520

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DigiPath Technology Company

USA . 636 parts In-Stock

1+ parts

$29.868

100+ parts

$27.479

1k+ parts

-

10k+ parts

-

636

$29.868

$27.479

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-

ChromeModa Solutions

Germany . 4,524 parts In-Stock

1+ parts

$30.478

100+ parts

$24.992

1k+ parts

-

10k+ parts

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4,524

$30.478

$24.992

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-

IDEA Electronic Components Group

UK . 2,321 parts In-Stock

1+ parts

$30.478

100+ parts

$28.954

1k+ parts

$27.430

10k+ parts

-

2,321

$30.478

$28.954

$27.430

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Overview

Experience unparalleled performance and reliability with the MSP430F67751IPEU by Texas Instruments, a leading manufacturer in the industry. This versatile microprocessor circuit offers endless possibilities in various applications, making it a must-have for your next project. With its advanced technology and high-quality construction, this IC provides exceptional value, efficiency, and functionality. Trust Texas Instruments to deliver superior products that exceed your expectations. Elevate your designs with the MSP430F67751IPEU and discover a world of innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltage, making it versatile and compatible with various power sources.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and fitting on the PCB, optimizing space utilization.

Bit Size: 16

16-bit architecture provides improved processing capabilities and performance compared to lower bit sizes.

Power Supplies (V): 2/3.3

Supports multiple power supply options, giving flexibility in design and application scenarios.

No. of Terminals: 128

Plenty of terminals enable connectivity with external components and peripherals, expanding functionality.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing and conversion, enhancing the product's versatility.

ROM Words: 131072

Large ROM capacity allows for storing and executing a wide range of programs and firmware, enabling complex functionalities.

RAM Words: 16

Sufficient RAM capacity for handling temporary data storage and processing, supporting smooth and efficient operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving energy efficiency and reliability.

Speed: 25 rpm

Provides sufficient processing speed for real-time applications and tasks, ensuring smooth and lag-free operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67751IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67751IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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